Dielectric IMD Enclosure With Integrated Feedthroughs and Hermetic Seal
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Solution Overview
Problem
Conventional implantable medical devices (IMDs) face challenges with overmolding processes that result in wasted space and increased costs due to yield fallout, necessitating a more efficient and cost-effective manufacturing method for IMD enclosures.
Innovation Solution
The use of dielectric materials to form IMD enclosures with a cavity, incorporating a header and a coupling member to create a hermetically sealed package, eliminating the need for feedthrough assemblies and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If overmolding processes are used to form IMD enclosures, then manufacturing capability is achieved, but space is wasted and costs increase due to yield fallout
Solution Approach 1:
The enclosure is divided into separate components: a header formed from dielectric material and a housing formed from conductive material. These components are manufactured separately and then assembled together, eliminating the need for overmolding processes and associated yield fallout while improving space utilization.
2Ease of manufacture
If overmolding processes are used to form IMD enclosures, then manufacturing capability is achieved, but manufacturing costs increase due to yield fallout
Solution Approach 1:
By segmenting the enclosure into separately manufacturable header and housing components, each can be optimized for its specific manufacturing process, reducing yield fallout and associated costs while maintaining manufacturing capability.
Solution Approach 2:
The separate header and housing components are merged through assembly to form the complete enclosure, eliminating the need for costly overmolding processes and their associated yield fallout.
3Reliability
If conventional feedthrough assemblies are used, then electrical connection is achieved, but device complexity increases
Solution Approach 1:
The feedthrough functionality is merged into the header itself, which is formed from dielectric material with integrated feedthrough structures. This eliminates the need for separate feedthrough assemblies and reduces overall device complexity while maintaining reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for increased space utilization and reduced manufacturing costs by eliminating the need for overmolding and feedthrough assemblies, while maintaining a hermetic seal and supporting various components within the IMD.
Implementation Method 1
a ring forming a hermetic seal between the coupling member and the header
Implementation Method 2
the header is formed from a non-conductive material
Data Source
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AI summary
Embodiments of the present disclosure relate to implantable medical device (IMD) enclosures. In an exemplary embodiment, an IMD comprises: a housing comprising an open end and a header defining a cavity and comprising at least one conduit through a wall of the header, wherein the header is formed from a non-conductive material. Further, the IMD comprises a coupling member comprising a flange, wherein the flange is configured to be received by the open end of the housing and wherein the flange and the open end of the housing at least partially overlap along an axial direction of the IMD when the flange is received by the open end. Additionally, the IMD comprises an electrode arranged on an outer surface of the header and a feedthrough coupled to the electrode and extending through the conduit of the header, wherein the feedthrough is configured to be coupled to internal circuity housed within the IMD. Further, the IMD comprises a ring forming a hermetic seal between the coupling member and the header.