Dielectric Layer With Varying Material Properties For Component Carrier

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Solution Overview

Problem

Current component carriers, such as PCBs, face challenges in efficiently manufacturing regions with varying electric and mechanical properties, particularly in high-frequency applications, due to complex and costly procedures for creating recesses with different dielectric constants.

Innovation Solution

A dielectric layer with sections of different materials, allowing for prefabrication of varying material properties, which can be laminated with conductive layers to form a component carrier with spatially distinct properties, facilitating easier and cost-effective manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If recesses are processed into the insulating substrate to achieve different dielectric constants in different regions, then the component carrier exhibits spatially varying electric properties, but the manufacturing process becomes elaborate and costly

Engineering Contradiction:

Improvespatially varying dielectric constantVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The dielectric layer is divided into multiple sections, each comprising different materials with different material properties. This segmentation allows each section to be optimized for specific functional requirements while simplifying the overall manufacturing process compared to processing recesses into a uniform substrate.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different sections of the dielectric layer are assigned different materials with specific properties tailored to local requirements. This enables spatially varying dielectric constants and material properties to be achieved through material selection rather than complex structural modifications.

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

If material with different dielectric constant is inserted into recesses, then the desired electric properties are achieved, but the manufacturing process becomes elaborate and costly

Engineering Contradiction:

Improvedifferent dielectric constant regionsVSAvoidprocess complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Multiple materials with different properties are combined within a single dielectric layer structure, eliminating the need for separate recess processing and material insertion steps. The different materials are integrated during the lamination process itself, reducing overall process complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The dielectric layer is constructed as a composite structure with multiple materials, each contributing specific properties. This composite approach achieves spatially varying dielectric constants through material composition rather than structural modification, simplifying manufacturing.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS11882648B2Dielectric layer for component carrier with varying material properties

Publication Date: 2024.01.23 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

AI summary

A dielectric layer for manufacturing a component carrier is described. The dielectric layer includes a first section including a first material having a first material property; and a second section including a second material having a second material property. The second material property is different from the first material property. A method for manufacturing such a component carrier and a component carrier including such a dielectric layer is further described.