Wavelength Conversion Bonding on Planarized Dielectric LED Surfaces
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Solution Overview
Problem
Existing methods for manufacturing light-emitting devices face challenges in achieving high bonding strength between the wavelength conversion member and the dielectric layer on the semiconductor parts.
Innovation Solution
A method involving the preparation of a wafer with semiconductor parts, covering them with a resin member, and then bonding a second substrate on top. After removing the first substrate, a dielectric layer is formed to cover the semiconductor parts and resin member, with its surface polished to be flat. The wavelength conversion member is then directly bonded to this flat surface for enhanced bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wavelength conversion member is bonded to a dielectric layer on semiconductor parts, then light extraction efficiency is improved, but bonding strength is insufficient
Solution Approach 1:
The patent applies preliminary action by forming a flat surface on the dielectric layer before bonding the wavelength conversion member. The manufacturing process includes steps to create a planarized dielectric layer surface in advance, ensuring optimal bonding conditions are established before the actual bonding operation occurs. This preliminary surface preparation resolves the bonding strength issue by creating a uniform, flat bonding interface.
2Productivity
If multiple semiconductor parts are arranged in a substrate, then manufacturing efficiency is improved, but separation and processing difficulty increases
Solution Approach 1:
The patent applies segmentation by arranging multiple semiconductor parts separately on a substrate rather than as a monolithic structure. Each semiconductor part is individually positioned and processed, allowing for independent handling and subsequent separation. This segmented approach maintains manufacturing efficiency through batch processing while reducing the complexity of separating and processing individual components later.
Solution Approach 2:
The substrate serves as an intermediary that temporarily holds multiple semiconductor parts during manufacturing. This mediator enables efficient batch processing while allowing for easy separation of individual parts when needed. The substrate facilitates the manufacturing process by providing a common platform for multiple components without permanently constraining them.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for a high bonding strength between the wavelength conversion member and the dielectric layer, improving the light extraction efficiency and stability of the light-emitting device.
Implementation Method 1
a dielectric layer being formed to continuously cover the portions of the multiple semiconductor parts and the portion of the resin member
Implementation Method 2
a step of causing an upper surface of the dielectric layer to approach flat
Implementation Method 3
a step of directly bonding a wavelength conversion member to the upper surface of the dielectric layer caused to approach flat
Data Source
AI summary
A method for manufacturing a light-emitting device includes preparing a wafer in which multiple semiconductor parts are arranged on a first surface of a first substrate, disposing a resin member covering the first surface and the multiple semiconductor parts, disposing a second substrate on the resin member, removing the first substrate, forming a dielectric layer continuously covering upper surfaces of the multiple semiconductor parts and an upper surface of the resin member, causing an upper surface of the dielectric layer to approach flat, selectively removing the dielectric layer located on the upper surface of the resin member, and directly bonding a wavelength conversion member to the upper surface of the dielectric layer.