Dielectric Lid Structure for Power Amplifier Radiation Feedback Suppression

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing power amplifier packaging technologies face challenges in managing radiation feedback, which affects the performance of power amplifiers in wireless communication systems due to competing requirements of bandwidth, output power, and linearity.

Innovation Solution

The electronic package includes a lid with a top wall comprising dielectric material and internal conductive layers embedded within the dielectric material, which extends between the input and output ends of a semiconductor, and is not electrically grounded, thereby suppressing radiation feedback.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If higher operating frequencies and increased operating power are used to meet wireless communication demands, then bandwidth and output power are improved, but radiation feedback and undesirable resonance increase, degrading amplifier performance

Engineering Contradiction:
Improveoutput powerVSAvoidradiation feedback
Core Design Contradiction:
PowerVSObject-generated harmful factors

Solution Approach 1:

The harmful radiated feedback signals are extracted and redirected through non-grounded conductive layers embedded in the lid structure, channeling them away from the amplifier input to prevent degradation of performance while maintaining high output power operation

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The lid with embedded conductive layers acts as an intermediary structure between the amplifier and the external environment, mediating the radiated feedback signals by capturing and redirecting them through the dielectric and conductive layer configuration, preventing direct feedback to the amplifier input

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If higher order modulation schemes and wider bandwidths are implemented, then communication capacity is improved, but linearity and stability deteriorate due to increased radiation feedback

Engineering Contradiction:
ImprovebandwidthVSAvoidlinearity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The radiated feedback signals, which are harmful to amplifier linearity, are converted into a controlled electromagnetic field within the lid structure through the embedded conductive layers, where they can be managed and redirected to prevent degradation of modulation scheme performance

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses feedback signals, improving the performance of power amplifiers by reducing undesirable resonance and feedback, thereby enhancing frequency response and stability.

Implementation Method 1

at least one internal conductive layer at least partially embedded within the at least one dielectric material... extends between an input end of the semiconductor and an output end of the semiconductor... suppressing radiation feedback

Methodology Applied
Scientific EffectElectromagnetic field: Electromagnetic Induction

Data Source

PatentUS20250201728A1Electronic component with lid to manage radiation feedback
Publication Date: 2025.06.19 QORVO US INC
  • US20250201728A1 patent drawing
  • US20250201728A1 patent drawing
  • US20250201728A1 patent drawing

AI summary

The disclosure is directed to an electronic device with a lid to manage radiation feedback. The electronic device includes a lid having at least one sidewall and a top wall, as well as a semiconductor positioned within a cavity of the lid. In certain embodiments, the lid includes at least one dielectric material and at least one internal conductive layer at least partially embedded within the at least one dielectric material. In certain embodiments, the lid includes dielectric material, as well as an internal wall extending from the top wall and positioned between an input port and an output port of the semiconductor. Such configurations may suppress any undesirable feedback through the lid between the input port and the output port of the semiconductor.