Dielectric Optical Component for Wavelength-Selective CMOS Sensing

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Solution Overview

Problem

Conventional CMOS sensors lack efficient wavelength filtering capabilities, leading to reduced sensitivity and increased manufacturing costs due to the need for complex and expensive techniques such as diffractive light trapping pixels and III-V semiconductor nanowires.

Innovation Solution

A dielectric structure with electrically conducting layers and openings is used to selectively transmit electromagnetic radiation of a specific wavelength, creating constructive interference and enhancing optical absorption in a silicon substrate, thereby increasing sensitivity without the need for complex filtering or micro-structuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a thick photon absorption layer is used to improve absorption efficiency, then optical absorption is improved, but manufacturing cost increases due to expensive equipment requirements

Engineering Contradiction:
Improveoptical absorption efficiencyVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

A dielectric layer is introduced as an intermediary between the incident light and the silicon photodetector. This dielectric layer acts as a mediator that enhances light coupling into the photodetector through constructive interference of edge diffracted and spherical waves, improving absorption efficiency without requiring a thicker silicon substrate, thus avoiding the need for expensive thick-substrate fabrication equipment

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the optical parameters by introducing a dielectric layer with specific refractive index and thickness parameters. The dielectric layer thickness and refractive index are optimized to create constructive interference that enhances light absorption in the photodetector, achieving improved absorption efficiency with standard manufacturing thicknesses

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If conventional CMOS sensors are used without wavelength selective absorption, then manufacturing is simpler, but filtering capacity is lost requiring additional complex filters

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidwavelength selective absorption capability
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent merges the wavelength selective filtering function with the existing dielectric layer structure already present in the CMOS sensor. The dielectric layer simultaneously serves as an optical mediator for enhancing absorption and as a wavelength-selective filter, eliminating the need for separate complex filtering structures and maintaining manufacturing simplicity while adding spectral selectivity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The dielectric layer is designed to perform multiple functions: it acts as an optical mediator to enhance light coupling, provides wavelength selective filtering, and maintains compatibility with standard CMOS fabrication processes. This multi-functionality eliminates the need for additional specialized filtering components

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If wavelength selective absorption is implemented using conventional techniques, then filtering capacity is improved, but device complexity increases due to complex manufacturing techniques

Engineering Contradiction:
Improvewavelength selective absorption capabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The dielectric layer serves as a simple intermediary structure that implements wavelength selective absorption through constructive interference of edge diffracted and spherical waves. This approach achieves filtering capacity without requiring complex manufacturing techniques, as the dielectric layer can be deposited using standard semiconductor fabrication processes

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves high photodetection for a selected wavelength while reflecting other wavelengths, increasing photon-generated charge carriers and sensitivity, as demonstrated by simulations showing a strong optical hotspot and enhanced optical power in the silicon substrate.

Implementation Method 1

enhancing optical absorption in a silicon photodetector through constructive interference of edge diffracted and spherical waves

Methodology Applied
Scientific EffectConstructive interference: Interference

Implementation Method 2

edge diffracted and spherical waves

Methodology Applied
Scientific EffectDiffraction: Diffraction

Implementation Method 3

Wavelength selective absorption has been proposed in literature by using techniques such as diffractive light trapping pixels

Methodology Applied
Scientific EffectWavelength selective absorption: Absorption (EM radiation)

Implementation Method 4

Some CMOS sensors operate on the photoelectric effect, which converts incident photons into electrical charges generating an electrical voltage

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS20230290796A1Optical component and image sensor comprising an optical component
Publication Date: 2023.09.14 INTERDIGITAL CE PATENT HOLDINGS SAS
  • US20230290796A1 patent drawing
  • US20230290796A1 patent drawing
  • US20230290796A1 patent drawing

AI summary

In example embodiments, an optical component includes a dielectric structure having a substantially rectangular cross-section with an upper surface and a lower surface. A first electrically conducting layer is provided on the upper surface, where the first electrically conducting layer has a first opening positioned to accept incoming electromagnetic radiation. The second electrically conducting layer has a second opening positioned to emit electromagnetic radiation, e.g. toward a CMOS sensor pixel in a silicon substrate. The dimensions of the optical component are configured to provide constructive interference for incident radiation of a selected wavelength.