Dielectric Plate Isolates Electrode in ALD Chamber
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Solution Overview
Problem
Atomic layer deposition (ALD) processes face challenges with contamination of the reaction chamber surfaces, requiring frequent cleaning which disrupts the coating process and affects other connected tools in a cluster tool setup, especially when plasma is involved, as the vacuum needs to be vented and re-evacuated, causing operational inefficiencies.
Innovation Solution
An apparatus with a reaction chamber featuring a dielectric plate between the substrate support and an electrode, allowing for plasma generation without contaminating the electrode, enabling residue to stay within the reaction chamber and facilitating easy cleaning of the dielectric plate, which acts as a sacrificial protector and insulator, allowing continuous operation without interrupting the coating process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If plasma is applied to enhance ALD coating, then coating effectiveness is improved, but electrode contamination increases requiring frequent cleaning
Solution Approach 1:
A removable dielectric plate is introduced as an intermediary component between the electrode and the reaction chamber. This plate allows plasma to be generated effectively for enhanced coating while preventing direct contact between plasma byproducts and the electrode, thus avoiding electrode contamination. The plate can be easily removed and cleaned separately without interrupting the main coating process.
Solution Approach 2:
The system is segmented into distinct functional zones: the electrode remains isolated in its chamber, while the dielectric plate forms a removable barrier that separates the plasma generation zone from the reaction chamber. This segmentation allows independent maintenance of each component, enabling cleaning of the dielectric plate without affecting the electrode or requiring chamber venting.
2Manufacturing precision
If reaction chamber surfaces are cleaned frequently to maintain quality, then coating quality is maintained, but process interruptions increase
Solution Approach 1:
The dielectric plate serves as a sacrificial intermediary that accumulates contamination instead of the chamber walls. Since only the plate needs cleaning rather than the entire chamber, cleaning operations are dramatically reduced in frequency and duration, maintaining coating quality while minimizing process interruptions.
Solution Approach 2:
The dielectric plate functions as a disposable or easily replaceable component that absorbs contamination. Rather than maintaining the entire expensive reaction chamber in a clean state, the system uses a low-cost, easily cleanable plate that can be removed and cleaned quickly, reducing both time loss and operational disruptions.
3Object-generated harmful factors
If vacuum is vented and re-evacuated for cleaning, then chamber cleanliness is restored, but operational efficiency decreases
Solution Approach 1:
The dielectric plate isolates the vacuum system from the contamination problem. Cleaning involves only removing and washing the plate, which does not require venting the vacuum chamber. This maintains continuous vacuum conditions in the chamber, allowing connected tools to operate without interruption and preserving operational efficiency while restoring chamber cleanliness.
4Power
If electrode is placed close to reaction chamber for plasma generation, then plasma effectiveness is improved, but residue deposition on electrode increases
Solution Approach 1:
The dielectric plate is positioned between the electrode and the reaction chamber, allowing the electrode to remain close enough for effective plasma generation while the plate itself blocks residue from depositing on the electrode. The plate can be optimized for dielectric properties that allow plasma coupling while being resistant to residue adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus maintains chamber cleanliness, reduces downtime for cleaning, and allows uninterrupted ALD processes by containing residues within the reaction chamber, ensuring effective and efficient coating without compromising the electrode's functionality.
Implementation Method 1
an electrode coupled to a voltage source to induce voltage to the electrode for generating electric discharge to the reaction space for generating plasma together with precursors
Implementation Method 2
a dielectric plate arranged between the substrate support and the electrode and such that the reaction space is arranged between the substrate support and the dielectric plate
Data Source
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AI summary
The invention relates to an apparatus for subjecting a surface of a substrate to surface reactions of at least a first precursor and a second precursor according to the principles of atomic layer deposition. The apparatus comprises a reaction chamber (1) forming a reaction space (2) for receiving precursor gases reacting on the surface of the substrate. The apparatus further comprises a substrate support (3) for holding the substrate; a dielectric plate (4); and an electrode (7) coupled to a voltage source (8) to induce voltage to the electrode (7) for generating electric discharge to the reaction space (2). The dielectric plate (4) is arranged between the substrate support (3) and the electrode (7) and such that the reaction space (2) is arranged between the substrate support (3) and the dielectric plate (4).