Dielectric Plate Alignment for Uniform Substrate Edge Plasma Treatment
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Solution Overview
Problem
Existing bevel etching apparatuses face spatial constraints and increased volume due to separate structures for moving dielectric plates, affecting the efficiency of plasma treatment on substrate edges.
Innovation Solution
An apparatus with a housing, support unit, dielectric plate unit, upper electrode unit, and aligning unit, featuring a lid with aligning bolts to precisely adjust the dielectric plate's horizontal position, ensuring accurate alignment and efficient plasma treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a separate structure for moving the dielectric plate is included, then the dielectric plate can be adjusted, but spatial constraints in forming the interior of the bevel etching apparatus increase and the volume of the apparatus increases
Solution Approach 1:
The patent combines the dielectric plate with the upper electrode into a single integrated unit, eliminating the need for separate moving structures. The upper electrode and dielectric plate are formed as one piece, allowing adjustment of the dielectric plate position through the existing electrode support mechanism, thereby reducing apparatus volume while maintaining adjustability.
2Ease of operation
If a separate structure for moving the dielectric plate is included, then the dielectric plate can be adjusted, but spatial constraints in forming the interior of the bevel etching apparatus increase
Solution Approach 1:
By integrating the dielectric plate with the upper electrode, the patent reduces the number of independent components and simplifies the overall structure. The alignment is achieved through the existing electrode positioning mechanism, eliminating the need for additional separate moving structures and reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the efficiency and uniformity of plasma treatment on substrate edges by allowing precise alignment of the dielectric plate, improving the treatment process.
Implementation Method 1
Plasma is an ionized gas state including ions, radicals, electrons, etc., and is generated in response to very high temperatures, strong electric fields, or radio frequency (RF) electromagnetic fields. A semiconductor device manufacturing process includes an ashing or etching process to remove a film material from a substrate by using plasma.
Data Source
AI summary
An apparatus for treating a substrate includes a housing including an open top and a treatment space therein, a gas supply unit configured to supply gas to the treatment space, a support unit including a chuck configured to support the substrate in the treatment space and an upper electrode provided to surround the check when viewed from the top, a dielectric plate unit including a dielectric plate arranged to oppose the substrate supported by the support unit in the treatment space, an upper electrode unit coupled to the dielectric plate unit and including an upper electrode arranged to oppose the lower electrode, and an aligning unit configured to align a horizontal arrangement of the dielectric plate unit, in which a lid extending from the housing in the horizontal direction and coupled to the upper electrode unit is provided on the housing, and the aligning unit is coupled to the lid.