Dielectric Plate Alignment for Uniform Substrate Edge Plasma
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in efficiently adjusting the relative position of a dielectric plate and substrate, leading to space limitations and reduced plasma processing efficiency for the edge region of the substrate.
Innovation Solution
A substrate processing apparatus with a housing, support unit, dielectric plate unit, upper electrode unit, and alignment unit, featuring a lead and alignment bolts for horizontal alignment of the dielectric plate, allowing precise positioning and efficient plasma treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a separate structure for moving the dielectric plate is provided, then the relative position of the dielectric plate and substrate can be adjusted, but space limitations occur and the device volume increases
Solution Approach 1:
The patent merges the dielectric plate moving function with the existing upper electrode support structure. The upper electrode support unit serves dual purposes: supporting the upper electrode and enabling movement of the dielectric plate. This eliminates the need for a separate moving mechanism, thereby reducing device volume while maintaining adjustability
Solution Approach 2:
The upper electrode support unit is designed to perform multiple functions: it supports the upper electrode, provides a moving mechanism for the dielectric plate, and enables position adjustment. This multi-functional design reduces the overall number of components and device volume while preserving the ability to adjust the dielectric plate position
2Ease of operation
If a separate structure for moving the dielectric plate is provided, then the relative position of the dielectric plate and substrate can be adjusted, but space limitations occur in configuring the interior
Solution Approach 1:
The patent combines the dielectric plate moving function with the upper electrode support structure, eliminating the need for additional space-consuming separate mechanisms. This merging approach preserves more processing space while maintaining the ability to adjust dielectric plate position
3Device complexity
If the dielectric plate position is not precisely aligned, then the device structure remains simple, but plasma processing efficiency for the edge region decreases
Solution Approach 1:
The patent replaces complex mechanical alignment systems with a simplified approach using alignment marks and visual or sensor-based detection. The alignment unit uses marks on the substrate and dielectric plate to achieve precise positioning without requiring complex mechanical adjustment mechanisms, thereby maintaining device simplicity while improving plasma processing efficiency
Solution Approach 2:
The alignment system is designed to be self-aligning through predefined alignment marks that guide the relative positioning of the substrate and dielectric plate. This self-service alignment mechanism eliminates the need for complex external alignment equipment while ensuring precise positioning for efficient plasma processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and uniform plasma treatment of the substrate edge region, improving processing efficiency and alignment accuracy.
Implementation Method 1
Plasma refers to an ionized gas state formed of ions, radicals, electrons, and the like, and is generated by a very high temperature, strong electric fields, or RF electromagnetic fields. Process gas excited to a plasma state is supplied to the edge of the substrate to etch the substrate.
Data Source
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AI summary
Disclosed is a substrate processing apparatus including: a housing with an open top and having a processing space therein; a gas supply unit for supplying gas to the processing space; a support unit including a chuck supporting a substrate in the processing space and a lower electrode provided to surround the chuck when viewed from above; a dielectric plate unit including a dielectric plate disposed opposite to the substrate supported by the support unit in the processing space; an upper electrode unit coupled to the dielectric plate unit, and including an upper electrode disposed opposite the lower electrode; and an alignment unit for aligning a disposition in a horizontal direction of the dielectric plate unit, in which a top portion of the housing is provided with a lead extending in the horizontal direction from the housing and coupled to the upper electrode unit, and the alignment unit is coupled to the lead.