Dielectric Plate Structure for Uniform VHF/UHF Plasma Processing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Plasma processing apparatuses with VHF or UHF frequency excitation face challenges in achieving uniform plasma distribution due to standing wave generation, which affects the uniformity of plasma in the processing area.

Innovation Solution

Incorporating a dielectric plate with a conductive film connected to the upper electrode and a thickness distribution in the radial direction to function as a capacitor, reducing standing wave generation and adjusting the wavelength of surface waves for improved plasma uniformity, along with a high frequency shield and gas flow paths for independent gas supply.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If VHF or UHF frequency excitation is used in plasma processing, then plasma processing efficiency is improved, but standing wave generation occurs causing non-uniform plasma distribution

Engineering Contradiction:
Improveplasma processing efficiencyVSAvoidplasma uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

A dielectric plate is introduced as an intermediary component between the upper electrode and the plasma processing chamber. This dielectric plate with specific thickness distribution (thinner at center, thicker at periphery) acts as a mediator to modify the electric field distribution and suppress standing wave formation, thereby maintaining plasma uniformity while using VHF/UHF frequency excitation for efficient processing

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If a dielectric plate with conductive film is added to suppress standing waves, then plasma uniformity is improved, but device complexity increases

Engineering Contradiction:
Improveplasma uniformityVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention merges multiple functions into a single integrated component: the dielectric plate simultaneously serves as an electrical insulator, a mechanical support structure, and a standing wave suppression element. By combining these functions in one component with optimized thickness distribution, the patent avoids adding separate complex systems while achieving plasma uniformity improvement

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses standing wave generation and enhances plasma uniformity by adjusting the electric field gradient and surface wave propagation, leading to improved plasma processing outcomes.

Implementation Method 1

The waveguide has an end and guides high frequency waves in a VHF band or a UHF band. The end is arranged to face the space and radiates high frequency waves to the space.

Methodology Applied
Scientific EffectElectromagnetic wave propagation: Electromagnetic Induction

Implementation Method 2

The dielectric plate includes a conductive film. The conductive film is provided on an upper surface of the dielectric plate. The upper surface faces the upper electrode. The conductive film is electrically connected to the upper electrode.

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS11923170B2Plasma processing apparatus and plasma processing method
Publication Date: 2024.03.05 TOKYO ELECTRON LTD
  • US11923170B2 patent drawing
  • US11923170B2 patent drawing
  • US11923170B2 patent drawing

AI summary

The plasma processing apparatus according to an exemplary embodiment includes a processing container, a stage, an upper electrode, a dielectric plate, and a waveguide. The stage is provided in the processing container. The dielectric plate is provided above the stage with a space in the processing container interposed therebetween. The upper electrode is provided above the dielectric plate. The waveguide has an end and guides high frequency waves in a VHF band or a UHF band. The end is arranged to face the space to radiate high frequency waves to the space. The dielectric plate includes a conductive film. The conductive film is provided on an upper surface of the dielectric plate. The upper surface faces the upper electrode. The conductive film is electrically connected to the upper electrode.