Multilayer Dielectric Resonator Cavities for Crack-Free Electrode Bonding
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Solution Overview
Problem
The existing multilayer dielectric resonators face structural defects due to stress generated by differences in thermal shrinkage rates between dielectric and external electrodes, leading to cracks and electrode breakage.
Innovation Solution
Forming cavities in the dielectric layer between internal electrodes, within a range of 0 μm to 200 μm from the connection point with external electrodes, to alleviate stress and prevent crack formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple internal electrode layers are connected to an external electrode in a multilayer dielectric resonator, then electrical connectivity is achieved, but stress is generated due to difference in thermal shrinkage rate between dielectric and external electrode, leading to structural defects
Solution Approach 1:
The patent introduces a cavity with specific physical characteristics (size range of 10-100 μm, located within 50 μm of the electrode connection point) to create a localized stress-relief zone. This local structural modification allows the dielectric layer to accommodate thermal shrinkage differences without generating harmful stress, thereby maintaining both electrical connectivity and structural integrity.
Solution Approach 2:
The cavity is pre-formed in the dielectric layer before the external electrode is attached. This beforehand cushioning structure provides a buffer zone that absorbs the stress generated during thermal processing, preventing crack formation at the electrode-dielectric interface while ensuring reliable electrical connection.
2Ease of manufacture
If dielectric layers are heated in a compression bonding step to achieve layer bonding, then manufacturing process is completed, but stress is generated due to difference in thermal shrinkage rate, causing cracks in the dielectric
Solution Approach 1:
The cavity is strategically positioned in the dielectric layer at the location where stress concentration is most likely to occur during compression bonding (within 50 μm of the electrode connection point). This localized structural feature allows the bonding process to proceed while the cavity absorbs the thermal stress, preventing cracks during manufacturing.
Solution Approach 2:
The patent modifies the physical structure of the dielectric layer by introducing a cavity with specific dimensional parameters (10-100 μm size, positioned within 50 μm of the electrode). This parameter change creates a stress-relief mechanism that enables successful compression bonding without generating harmful stresses during the heating process.
3Strength
If a cavity is formed in the dielectric layer near the electrode connection point, then stress is alleviated and cracks are prevented, but the device structure becomes more complex
Solution Approach 1:
Instead of modifying the entire dielectric structure, the patent introduces a small, localized cavity (10-100 μm) only in the critical stress zone (within 50 μm of the electrode connection point). This minimal local modification provides stress relief while maintaining the overall simplicity of the device structure.
Solution Approach 2:
The cavity is formed only in the specific region where stress concentration occurs, rather than throughout the entire dielectric layer. This partial action approach provides sufficient stress relief to prevent cracks while minimizing the added structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The formation of cavities effectively reduces the occurrence of cracks and structural defects, enhancing the quality and reliability of electronic components.
Implementation Method 1
when the plurality of dielectric layers are heated in a compression bonding step, stress is generated due to a difference in thermal shrinkage rate between the dielectric body and the external electrode
Data Source
AI summary
An electronic component includes: a multilayer body including a plurality of dielectric layers that are stacked; an external electrode disposed on at least one surface of external surfaces of the multilayer body; and internal electrodes disposed respectively in a plurality of layers of the multilayer body and connected to the external electrode. At least one cavity is formed in a dielectric layer between the internal electrodes, the at least one cavity being formed in a range of 0 μm to 200 μm in a direction from a connecting position where the external electrode is connected to the internal electrodes, the internal electrodes extending in the first direction.