Dielectric Resonator Via Layout for Multimode Miniaturization

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Solution Overview

Problem

Existing resonators and filters face challenges in maintaining performance while achieving miniaturization, particularly in dielectric multimode resonators where modes are not decoupled, leading to low productivity and difficulty in reducing volume without compromising performance.

Innovation Solution

The proposed solution involves a resonator design with a dielectric body featuring blind vias on the top surface and side walls, including through grooves and additional blind vias, which allows for the addition of resonant modes from side surfaces, thereby reducing the area occupied on the top surface and improving space utilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a native multimode with symmetry structure is used, then the resonator can support multiple modes, but the modes are not decoupled leading to low productivity and difficulty in miniaturization

Engineering Contradiction:
Improvemode decoupling efficiencyVSAvoidresonator volume
Core Design Contradiction:
ProductivityVSVolume of moving object

Solution Approach 1:

The patent employs asymmetric structures including L-shaped metal plates and non-symmetric via hole arrangements to achieve mode decoupling. The asymmetric geometry breaks the symmetry of the resonator, allowing independent control of different resonant modes and improving productivity while enabling compact design.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent utilizes three-dimensional via holes extending in multiple directions (vertical and lateral dimensions) to achieve mode decoupling in space. By transitioning from two-dimensional planar structures to three-dimensional volumetric structures, the patent enables independent mode control and miniaturization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If the volume of the resonator is reduced, then miniaturization is achieved, but the performance of the resonator cannot be ensured

Engineering Contradiction:
Improveresonator volumeVSAvoidresonator performance
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent embeds multiple via holes and metal plates within the resonator structure, nesting functional elements inside the dielectric body. This nested arrangement allows multiple resonant modes to coexist in a compact volume while maintaining performance through proper spatial configuration and coupling.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent optimizes performance parameters including via hole diameter, depth, spacing, and metal plate dimensions to maintain resonator performance in a miniaturized configuration. By carefully adjusting these geometric parameters, the patent achieves both compact size and reliable performance.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves miniaturization of the resonator and filter while maintaining performance, as it enhances space utilization and allows for optimal adjustment of filter parameters through strategic placement of blind vias and grooves.

Implementation Method 1

each of the first blind vias forms one single-mode dielectric waveguide

Methodology Applied
Scientific EffectWaveguide: Waveguide

Implementation Method 2

one first blind via forms a resonant cavity

Methodology Applied
Scientific EffectResonance: Resonance

Data Source

PatentUS20250293423A1Resonator, filter, dynamic antenna element, and remote radio unit
Publication Date: 2025.09.18 HUAWEI TECH CO LTD
  • US20250293423A1 patent drawing
  • US20250293423A1 patent drawing
  • US20250293423A1 patent drawing

AI summary

A resonator includes a dielectric body including a top and bottom surface, and side walls between the top and bottom surface. The resonator further includes at least two first blind vias within the dielectric body, a through groove between at least two first blind vias, and at least one second blind via is on a side wall of the side walls between the at least two first blind vias. The at least two first blind vias extend toward the bottom surface. The at least two first blind vias are arranged in a first direction. The at least one second blind via extends from a surface of the side wall of the side walls to the through groove. An extension direction of the at least one second blind via is perpendicular to the first direction. The at least one second blind via and the through groove are separated from each other.