Pinhole-Free Dielectric Sealing for Display Devices

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Solution Overview

Problem

Display devices, particularly OLED and polyLEDs, are vulnerable to oxygen and moisture exposure leading to degradation, and existing sealing methods are either ineffective or require high temperatures incompatible with polymer-based devices, while also being sensitive to mechanical forces that can break the surface and compromise the seal.

Innovation Solution

A dielectric sealing structure with at least two layers, optionally a third transparent layer, combined with a stabilisation layer deposited using low-temperature methods like PECVD or inkjet printing, forms a pinhole-free, scratch-resistant, and water/oxygen impermeable barrier that encapsulates protrusions and provides mechanical stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metal films are evaporated to seal display devices, then sealing against oxygen and moisture is achieved, but the films contain pinholes requiring greater thickness which results in poor light transmission

Engineering Contradiction:
Improvesealing effectivenessVSAvoidlight transmission
Core Design Contradiction:
ReliabilityVSIllumination intensity

Solution Approach 1:

The patent employs a composite sealing structure consisting of a dielectric sealing layer (such as silicon oxide, silicon nitride, or silicon oxynitride) combined with an organic planarisation layer. This composite approach creates a pinhole-free barrier that provides effective sealing against oxygen and moisture while maintaining sufficient light transmission, overcoming the limitations of single-layer metal film evaporation methods.

Inventive Principle:
Principle #40Composite materials

2Reliability

If temperatures above 300°C are used during the sealing process, then proof encapsulation is achieved, but polymer-based devices are damaged due to incompatibility with high temperatures

Engineering Contradiction:
Improveencapsulation qualityVSAvoidprocessing temperature
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent utilizes plasma-enhanced chemical vapour deposition (PECVD) to deposit dielectric sealing layers at low temperatures (below 300°C, typically in the range of 100-250°C). This parameter change in the deposition process temperature enables effective encapsulation and sealing of polymer-based display devices without causing thermal damage to the organic or polymer materials, while still achieving pinhole-free barriers with excellent moisture and oxygen protection.

Inventive Principle:
Principle #35Parameter changes

3Strength

If additional protective layers and scratch resistant layers are deposited on the barrier assembly, then mechanical strength is improved, but the manufacturing process becomes complicated and expensive and the assembly becomes relatively thick

Engineering Contradiction:
Improvemechanical strengthVSAvoidmanufacturing complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent designs the organic planarisation layer to serve multiple functions simultaneously: it provides mechanical protection and scratch resistance to the underlying dielectric sealing layer, ensures uniform thickness distribution, and maintains optical quality. By making this layer multi-functional, the patent eliminates the need for separate protective and scratch-resistant layers, thereby simplifying the manufacturing process, reducing production complexity and cost, and avoiding excessive thickness while still achieving improved mechanical strength.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly extends the durability of display devices by preventing moisture and oxygen ingress, enhancing mechanical robustness, and eliminating the need for additional protective layers, resulting in thinner, lighter, and more durable displays with improved optical properties.

Implementation Method 1

Efforts have been made by evaporating metal films to seal display devices

Methodology Applied
Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Implementation Method 2

The stabilisation layer is formed on the sealing structure and is intended to stabilise and protect the sealing structure

Methodology Applied
Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Implementation Method 3

The stabilisation layer is formed on the sealing structure and is intended to stabilise and protect the sealing structure, as well as to provide a scratch resistant surface on the display device

Methodology Applied
Scientific EffectSurface Hardening:

Implementation Method 4

The sealing structure comprises at least two layers of dielectric material. By using at least two layers, a pinhole free structure is obtained

Methodology Applied
Scientific EffectLayered Deposition:

Data Source

PatentUS7710032B2Encapsulation structure for display devices
Publication Date: 2010.05.04 BEIJING XIAOMI MOBILE SOFTWARE CO LTD
  • US7710032B2 patent drawing
  • US7710032B2 patent drawing

AI summary

An encapsulation structure for a display device includes a sealing structure and a stabilization layer. The sealing structure is an essentially water/oxygen impermeable film which covers environmentally sensitive parts and protrusions on the display device. The stabilization layer covers the display device, protrusions on the display and the sealing structure with a scratch resistant protective layer, resulting in a water/oxygen impermeable and scratch resistant encapsulation structure.