Dielectric Material Segmentation for Semiconductor Chip Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to develop smaller electronic devices with increased functionality while maintaining or improving performance in demanding environments, such as those in the automotive industry, where space is limited and devices must operate efficiently under various conditions.
Innovation Solution
The solution involves manufacturing semiconductor chips with a vertical structure and using a method that includes applying a dielectric material, creating recesses, and depositing a paste with sintered metal particles to form interconnect elements and external contact pads, allowing for increased packaging density and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If chips are attached to each other with a dielectric material to increase packaging density, then the device size is reduced and functionality is increased, but the thermal management capability deteriorates due to the insulating nature of dielectric materials
Solution Approach 1:
The dielectric material layer is segmented into multiple regions: a first region with lower dielectric constant for general insulation, and a second region with higher thermal conductivity specifically for heat dissipation pathways. This segmentation allows simultaneous optimization of electrical insulation and thermal management in different spatial zones.
Solution Approach 2:
Different regions of the dielectric material are assigned different material properties: the first region prioritizes electrical insulation with lower dielectric constant, while the second region prioritizes thermal conduction with higher thermal conductivity. This local differentiation resolves the contradiction between electrical function and thermal management.
2Reliability
If a dielectric material with low dielectric constant is used to reduce capacitance between chips, then signal integrity is improved, but thermal conductivity deteriorates due to the insulating properties of low-k materials
Solution Approach 1:
The dielectric material is divided into functionally distinct regions: a first region optimized for electrical performance with lower dielectric constant to minimize capacitance, and a second region optimized for thermal performance with higher thermal conductivity. This spatial segmentation allows both electrical and thermal requirements to be satisfied simultaneously.
Solution Approach 2:
The dielectric material structure functions as a composite system where different material regions with contrasting properties are combined: low-k material for electrical insulation and high-thermal-conductivity material for heat dissipation. This composite approach resolves the inherent trade-off between electrical and thermal properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of compact, high-functionality electronic devices with improved thermal management and electrical connectivity, addressing the need for reduced size and enhanced performance in constrained spaces.
Implementation Method 1
depositing a paste with sintered metal particles to form interconnect elements and external contact pads
Implementation Method 2
applying a dielectric material, creating recesses
Data Source
AI summary
A semiconductor device and manufacturing method. One embodiment provides at least two semiconductor chips. A dielectric material is applied to the at least two semiconductor chips to attach the at least two semiconductor chips to each other. A portion of the dielectric material is selectively removed between the at least two semiconductor chips to form at least one recess in the dielectric material. Metal particles including paste is applied to the at least one recess in the dielectric material.