Dielectric Composition with Controlled Segregation for MLCC Densification
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Solution Overview
Problem
Existing dielectric compositions in multilayer ceramic electronic components face challenges in achieving high density and reliability due to the presence of Y-Ti segregation particles, which hinder densification and affect the performance of the dielectric layers.
Innovation Solution
A dielectric composition comprising a main phase with a perovskite crystal structure and segregated phases of RE, A, Si, and Ti, with controlled area and diameter ratios, enhances densification and prevents grain growth, resulting in high relative permittivity and specific resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If Y-Ti segregation particles are included in dielectric layers, then the number of layers increases and layer thickness decreases, but densification of dielectric composition is hindered
Solution Approach 1:
The patent changes the chemical composition parameters of segregation particles by specifying precise ratios of Ba, Ti, RE, and Si elements. By controlling the Ba/Ti atomic ratio to be 0.5-2.0 and incorporating specific amounts of RE (0.1-5.0 wt%) and Si (0.1-5.0 wt%), the segregation particles achieve both fine dispersion for layer thinning and adequate densification capability.
Solution Approach 2:
The patent creates composite segregation particles combining multiple elements (Ba, Ti, RE, Si) in specific proportions. This composite structure allows the particles to simultaneously provide electrical insulation for layer multiplication and sintering promotion for densification, resolving the contradiction between increased layer count and maintained density.
2Length of moving object
If segregation particles are increased to improve layer thinning, then dielectric layer density decreases
Solution Approach 1:
The patent optimizes the size and composition parameters of segregation particles. By controlling particle size to 0.1-10 μm and adjusting chemical composition (Ba/Ti ratio of 0.5-2.0, RE content of 0.1-5.0 wt%, Si content of 0.1-5.0 wt%), the particles effectively reduce layer thickness while maintaining or improving dielectric density through enhanced sintering behavior.
Solution Approach 2:
The segregation particles act as intermediary substances that facilitate sintering between dielectric grains. The specific composition with RE and Si elements promotes grain boundary formation and densification during sintering, allowing layer thinning to proceed without sacrificing overall dielectric density.
3Productivity
If dielectric layers are thinned to increase layer count, then relative permittivity and specific resistance deteriorate
Solution Approach 1:
The patent adjusts the chemical composition parameters of segregation particles to control dielectric properties. By optimizing Ba/Ti ratio (0.5-2.0), RE content (0.1-5.0 wt%), and Si content (0.1-5.0 wt%), the thinned dielectric layers maintain adequate relative permittivity and specific resistance while achieving higher layer counts.
Solution Approach 2:
The patent introduces segregation particles with specific local compositions at grain boundaries and interfaces. These locally optimized regions with RE and Si elements provide enhanced electrical insulation and dielectric properties, compensating for the reduced layer thickness and maintaining overall device reliability.
Data Source
AI summary
A dielectric composition includes a main phase, first segregation phases, and second segregation phases. The main phase includes a main component having a perovskite crystal structure of ABO3 (A is one or more selected from Ba, Sr, and Ca, and B is one or more selected from Ti, Zr, and Hf). The first segregation phases include RE (one or more selected from rare earth elements), A, Si, Ti, and O. The second segregation phases include RE, A, Ti, and O and do not substantially include Si. 0.10<S2/S1≤1.50 is satisfied on a cross section of the dielectric composition, where S1 is an area ratio of the first segregation phases, and S2 is an area ratio of the second segregation phases.