Dielectric Sheet Handling via Pressure-Sensitive Adhesive Layer

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Solution Overview

Problem

Dielectric sheets with high dielectric polymer cured materials, especially those with fluoroalkyl groups, face issues with flexibility and physical strength, leading to damage and reduced flatness when packaged into devices, affecting manufacturing efficiency and performance.

Innovation Solution

A layered body comprising a high dielectric sheet with a dielectric functional group and at least one pressure-sensitive adhesive layer, which improves handling and physical strength, allowing for easier packaging without compromising flatness or dielectric performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If dielectric sheets with high dielectric polymer cured materials (especially those with fluoroalkyl groups) are used, then dielectric performance is improved, but flexibility and physical strength deteriorate, leading to damage and reduced flatness when packaged into devices

Engineering Contradiction:

Improvedielectric performanceVSAvoidphysical strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies composite materials by combining the high dielectric polymer cured material with a supporting substrate material. This creates a composite structure where the polymer layer provides dielectric performance while the substrate provides mechanical strength and flexibility, resolving the contradiction between dielectric performance and physical strength

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent uses thin film structures where the high dielectric polymer layer is formed as a thin coating on a substrate. This thin film approach maintains dielectric performance while the substrate provides the necessary mechanical strength and flexibility for handling and packaging

Inventive Principle:

Principle #30Flexible shells and thin films

2Reliability

If dielectric sheets with high dielectric polymer cured materials are used, then dielectric performance is improved, but handling ease deteriorates, making packaging difficult and reducing manufacturing efficiency

Engineering Contradiction:

Improvedielectric performanceVSAvoidhandling ease

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

By creating a composite structure with a substrate and polymer coating, the patent makes the dielectric sheet easier to handle. The substrate provides mechanical support that prevents damage during handling and packaging, while the polymer layer maintains dielectric performance

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies the polymer cured material to the substrate in advance to form an integrated layered body before packaging. This preliminary action ensures the dielectric layer is properly positioned and protected, making subsequent handling and packaging easier and more efficient

Inventive Principle:

Principle #10Preliminary action

3Reliability

If dielectric sheets with high dielectric polymer cured materials are used, then dielectric performance is improved, but flatness is reduced due to damage during packaging, affecting device performance

Engineering Contradiction:

Improvedielectric performanceVSAvoidflatness

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The composite structure with substrate and polymer layer protects the dielectric material during packaging. The substrate provides rigidity that maintains flatness, while the polymer layer ensures dielectric performance is not compromised

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent uses the substrate as a protective backing that cushions and protects the high dielectric polymer layer during handling and packaging. This beforehand protection prevents damage that would otherwise reduce flatness and affect manufacturing precision

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables easier handling and mounting of dielectric sheets with improved flexibility and dielectric performance, enhancing manufacturing efficiency and maintaining the integrity of the dielectric sheet's flatness and functionality.

Implementation Method 1

at least one pressure-sensitive adhesive layer

Methodology Applied

Scientific EffectPressure-sensitive adhesion: Adhesive

Data Source

PatentUS11858250B2Multilayer structure and uses thereof

Publication Date: 2024.01.02 DOW TORAY CO LTD

AI summary

This disclosure provides an electronic device member that is superior in ease of handling, without any loss of flatness or performance (e.g. flexibility and dielectric properties) despite being a dielectric sheet having a dielectric polymer cured material that is physically fragile. Disclosed herein is a layered body including (L1) a single layer or multiple layers of a high dielectric sheet that includes a polymer cured material having a dielectric functional group, and at least one (L2) pressure-sensitive adhesive layer, and in general further having (L3) an electrode layer and/or (L4) a non-silicone thermoplastic resin layer, and uses thereof.