Dielectric Slurry Emulsion for Sheet-Attack-Free MLCC Layers
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Solution Overview
Problem
The sheet attack phenomenon and agglomeration of dielectric particles occur in conventional dielectric slurries due to the use of organic solvents, leading to decreased insulation performance and increased short circuit rates in multilayer ceramic capacitors, and existing methods like tape casting and inkjet printing face inefficiencies.
Innovation Solution
A dielectric slurry composition with a hydrophobic solvent and dielectric particles in an emulsion structure within a hydrophilic solvent, hydrophilic dispersant, and hydrophilic binder solution, allowing for improved dispersibility and preventing agglomeration, and using inkjet printing without solvent drying.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional dielectric slurry with organic solvent is used, then the slurry can be applied to form dielectric layer, but sheet attack phenomenon occurs where organic solvent swells or dissolves organic binder in ceramic green sheet
Solution Approach 1:
The patent changes the fundamental parameter of solvent type from organic to aqueous. The dielectric slurry uses water as the solvent instead of organic solvents, which eliminates the sheet attack phenomenon while maintaining the ability to form dielectric layers. This parameter change resolves the contradiction by removing the harmful chemical interaction between organic solvent and organic binder.
Solution Approach 2:
The patent employs readily available aqueous materials (water-based solvents) instead of specialized organic solvents. This substitution with simpler, more benign materials eliminates the reliability issues while maintaining manufacturing feasibility, aligning with the principle of using simpler substitutes to resolve technical contradictions.
2Reliability
If aqueous materials are used to prevent sheet attack, then insulation performance is improved, but dispersibility of dielectric powder varies according to binder and dispersant composition
Solution Approach 1:
The patent systematically optimizes parameters within the aqueous system, including selecting specific water-soluble binders and dispersants, adjusting their concentrations, and controlling pH levels. These parameter adjustments within the aqueous framework achieve both good dispersibility and maintained insulation performance, resolving the contradiction between reliability and manufacturing precision.
Solution Approach 2:
The patent creates a composite aqueous system combining water-soluble binders, dispersants, and dielectric powder in specific proportions. This composite approach allows synergistic interaction between components to achieve optimal dispersibility while maintaining the insulation benefits of the aqueous base, addressing the variability issue through controlled composition.
3Manufacturing precision
If tape casting method is used to apply dielectric slurry, then dielectric layer can be formed, but excessive time is consumed due to requirement of complete drying of internal electrode paste
Solution Approach 1:
The patent enables continuous processing by eliminating the drying wait time between internal electrode paste application and dielectric slurry application. Since both materials are aqueous-based, they can be applied sequentially without interruption, maintaining continuous production flow and significantly improving productivity while preserving manufacturing precision.
Solution Approach 2:
The patent applies the dielectric slurry in a preliminary state before complete drying of the internal electrode paste. The aqueous-based formulation allows the slurry to be applied and subsequently dried together in a single drying step, eliminating the need for preliminary complete drying and reducing overall process time.
4Productivity
If inkjet printing is used to apply dielectric slurry with organic solvent, then application without complete drying is possible, but discharge inlet of inkjet is blocked and cleaning becomes difficult
Solution Approach 1:
The patent substitutes water for organic solvent in the inkjet-printed dielectric slurry. Water-based formulations are easily pumpable through inkjet nozzles without clogging and can be readily cleaned from the discharge inlet using simple water rinsing, eliminating the maintenance difficulties associated with organic solvents while maintaining high application efficiency.
Solution Approach 2:
The patent changes the solvent parameter from organic to aqueous, which fundamentally alters the flow and cleaning characteristics. The aqueous formulation has better pumpability and cleaner evaporation properties, allowing continuous inkjet operation without blockage and simplifying maintenance procedures while preserving productivity benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents sheet attack and agglomeration, ensuring high insulation performance and efficient application of thin dielectric layers, facilitating miniaturization and high capacity in multilayer ceramic capacitors.
Implementation Method 1
a second solution including a hydrophilic solvent, a hydrophilic dispersant, and a hydrophilic binder, wherein at least a portion of the first solution has an emulsion structure in the second solution
Implementation Method 2
a first solution including a hydrophobic solvent and dielectric particles; and a second solution including a hydrophilic solvent, a hydrophilic dispersant, and a hydrophilic binder, wherein at least a portion of the first solution has an emulsion structure in the second solution
Data Source
AI summary
A dielectric slurry composition according to an embodiment of the present disclosure includes: a first solution including a hydrophobic solvent and dielectric particles; and a second solution containing a hydrophilic solvent, a hydrophilic dispersant, and a hydrophilic binder, wherein at least a portion of the first solution has an emulsion structure in the second solution.