Dielectric Surface Smoothing via Cured Laminate
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Solution Overview
Problem
Existing dielectric surface smoothing techniques, such as curing processes, are limited in achieving a smooth surface necessary for effective electroless deposition and physical vapor deposition, and downstream processes like desmearing increase surface roughness, hindering electrical performance.
Innovation Solution
A method involving the application of a laminate to a dielectric surface, followed by curing and subsequent removal, which shapes the surface to achieve a smoothness of 40-75 nanometers, and using physical vapor deposition for metal layer deposition, while minimizing the impact of desmearing on surface roughness by maintaining the laminate during drilling and desmearing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If electroless deposition is used to coat the dielectric, then adhesion is improved, but surface smoothness deteriorates
Solution Approach 1:
The patent applies a preliminary action by forming a laminate layer on the dielectric surface before performing electroless deposition. This laminate layer is cured first to create a smooth surface, then a metal layer is deposited over it. This preliminary laminate formation prepares the surface to achieve both smoothness and subsequent adhesion through the metal layer.
Solution Approach 2:
The patent uses an intermediary approach by introducing a laminate layer as a mediator between the dielectric surface and the metal coating. This laminate serves as an intermediate layer that can be cured to provide smoothness while allowing the metal layer to be deposited on top, resolving the conflict between surface smoothness and adhesion.
2Manufacturing precision
If curing process is optimized to reduce surface roughness, then surface smoothness is improved, but downstream processing difficulty increases
Solution Approach 1:
The patent performs the curing action preliminarily before downstream processing steps. By curing the laminate layer early in the process, the surface is smoothed before via formation and desmearing operations, making subsequent downstream processing easier rather than more difficult.
Solution Approach 2:
The patent inverts the conventional sequence by performing the smoothing/curing action before the downstream processing steps rather than after. This reversal of the traditional sequence resolves the contradiction by establishing smoothness early, which actually facilitates downstream processing.
3Manufacturing precision
If physical vapor deposition is used to deposit metal layer, then surface smoothness is maintained, but adhesion requirement changes
Solution Approach 1:
The patent uses the laminate layer as an intermediary that enables physical vapor deposition. The laminate provides a suitable surface for PVD metal layer deposition while maintaining smoothness, and the metal layer subsequently provides the necessary adhesion properties, resolving the adaptability requirement.
Solution Approach 2:
The patent changes the surface parameters by first creating a smooth surface through cured laminate, then using physical vapor deposition to add a metal layer with different properties. This parameter change approach allows the surface to transition from smooth organic to smooth metallic, satisfying both smoothness and adhesion requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a dielectric surface with reduced roughness, enhancing adhesion and electrical performance by maintaining smoothness and reducing the need for additional surface treatments, thereby improving the overall efficiency of dielectric-metal interfaces.
Implementation Method 1
curing the second surface while the laminate remains applied
Implementation Method 2
depositing a metal layer onto the second surface using a physical vapor deposition (PVD) process
Implementation Method 3
In other PVD processes known as 'sputtering,' the desired film material (sometimes referred to as the 'target material') may be bombarded by energetic particles
Data Source
AI summary
Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface, curing the second surface while the laminate remains applied, and removing the laminate. Other embodiments may be described and/or claimed.