Dielectric Spacers for Embedded Substrate Short Circuit Prevention
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Solution Overview
Problem
Electronic component embedded printed circuit boards face defects due to short circuits caused by adjacent parts contacting each other during fabrication, as the size of cavities decreases and the number of embedded parts increases, limiting circuit design freedom.
Innovation Solution
Incorporating dielectric spacers between adjacent electronic components in the cavity of a core substrate to prevent electrical connections and stabilize their position, using materials like resin, polymer, or prepreg, which can be formed in various shapes and applied as films, pastes, or through vacuum evaporation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the cavity size is decreased and the number of embedded parts is increased, then the circuit design freedom is improved, but the risk of short circuit between embedded parts increases
Solution Approach 1:
The patent introduces a filling material as an intermediary substance between adjacent electronic components embedded in the cavity. This filling material physically separates the components, preventing direct contact and potential short circuits, while still allowing the components to be densely packed to maintain circuit design freedom.
Solution Approach 2:
The filling material is applied beforehand to prevent potential short circuits between electronic components. By pre-positioning this protective material in the cavity, the patent ensures that even if components shift during fabrication or operation, they remain separated and cannot make harmful electrical contact.
2Quantity of substance
If electronic components are densely packed in the cavity, then the substrate integration is improved, but the manufacturing precision requirement increases
Solution Approach 1:
The filling material serves as a positioning intermediary that maintains precise spacing between densely packed electronic components. This material allows components to be placed closer together while still ensuring proper separation, effectively reducing the manufacturing precision burden without compromising component density.
Solution Approach 2:
The patent changes the physical parameters of the cavity environment by introducing the filling material, which modifies the spacing and positioning characteristics. This allows for increased component density while maintaining adequate separation, effectively decoupling the relationship between quantity of components and manufacturing precision requirements.
3Volume of moving object
If the cavity size is decreased, then the substrate compactness is improved, but the component separation becomes more difficult
Solution Approach 1:
The filling material acts as a separation intermediary that maintains adequate distance between components even in reduced cavity volumes. By introducing this material, the patent effectively increases the functional separation distance without increasing the physical cavity size, allowing compact substrate design while preventing component contact.
Data Source
AI summary
An electronic component embedded substrate is disclosed. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core substrate having a cavity formed therein; a plurality of electronic components embedded in the cavity and arranged in a predetermined format; and a plurality of dielectric spacers interposed in between the plurality of electronic components that are adjacent to one another in the cavity.