Dielectric Spray Cooling Housing With Embedded Heat Exchange
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Solution Overview
Problem
Existing thermal regulation devices for electrical and electronic components, such as those in motor vehicle batteries and data centers, face issues with irregular cooling, high thermal resistance, and large size due to the use of heat exchangers, leading to increased energy consumption and complexity in design.
Innovation Solution
A thermal regulation device with a housing that incorporates a dielectric fluid circuit and thermal elements, featuring orifices for fluid spraying and a heat exchanger section within the housing walls, allowing for efficient heat exchange and fluid circulation, reducing the need for extensive ductwork and simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat exchangers are used for thermal regulation, then temperature control is achieved, but thermal resistance increases and cooling homogeneity decreases
Solution Approach 1:
The patent extracts the thermal regulation function from a separate heat exchanger component and integrates it directly into the housing walls. The thermal elements are embedded within the wall structure itself, eliminating the need for external heat exchangers and reducing thermal resistance between the regulated space and the thermal control mechanism.
Solution Approach 2:
The housing structure and thermal regulation system are merged into a single integrated component. The walls of the housing simultaneously serve as structural boundaries and as thermal control elements, with thermal elements embedded within the wall thickness to provide direct thermal regulation without requiring separate heat exchanger assemblies.
2Temperature
If heat exchangers with sufficient clearance are used, then thermal regulation is effective, but device size increases
Solution Approach 1:
The housing structure and thermal regulation system are merged into a single integrated component. The walls of the housing simultaneously serve as structural boundaries and as thermal control elements, with thermal elements embedded within the wall thickness to provide direct thermal regulation without requiring separate heat exchanger assemblies.
Solution Approach 2:
The thermal elements are nested within the wall structure of the housing. The walls contain embedded thermal elements that utilize the wall thickness itself as the heat transfer path, eliminating the need for additional clearance space that would be required for external heat exchangers.
3Temperature
If complex ductwork is used for fluid circulation, then thermal regulation coverage is improved, but device complexity increases
Solution Approach 1:
The patent extracts the thermal regulation function from a separate heat exchanger component and integrates it directly into the housing walls. The thermal elements are embedded within the wall structure itself, eliminating the need for external heat exchangers and reducing thermal resistance between the regulated space and the thermal control mechanism.
Solution Approach 2:
The housing structure and thermal regulation system are merged into a single integrated component. The walls of the housing simultaneously serve as structural boundaries and as thermal control elements, with thermal elements embedded within the wall thickness to provide direct thermal regulation without requiring separate heat exchanger assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances cooling homogeneity, reduces thermal resistance, and minimizes the size of the device, leading to improved energy efficiency and simplified assembly, while maintaining effective temperature regulation for electrical and electronic components.
Implementation Method 1
a section formed within one of the walls of the housing, the section of the dielectric fluid circuit also receives a thermal element which is designed to exchange heat with the dielectric fluid circulating in the dielectric fluid circuit
Implementation Method 2
a thermal element which is designed to exchange heat with the dielectric fluid circulating in the dielectric fluid circuit
Implementation Method 3
at least one of the walls of the housing comprises at least one orifice for spraying of dielectric fluid in the receptacle
Data Source
AI summary
The present invention relates to a thermal regulation device for an electrical or electronic component. The thermal regulation device includes at least one housing. The housing includes a plurality of walls that delimit a receptacle. The receptacle is designed to receive the electrical or electronic component. The device also includes a dielectric fluid circuit configured to permit the circulation of a dielectric fluid. At least one of the walls of the housing includes at least one orifice for spraying dielectric fluid in the receptacle. The spraying orifice is fluidically connected to the dielectric fluid circuit. The circuit includes a section formed within one of the walls of the housing. The section also receives a thermal element that is designed to exchange heat with the dielectric fluid circuit.