Selective Dielectric Substrate Activation via Localized Radiation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for selective activation of dielectric substrates, such as those used in electronic circuit assembly, require the unspecific introduction of activating compounds into the substrate material or the application and removal of layers, which are inefficient and costly, and often necessitate complex recycling processes.

Innovation Solution

A method involving the application of a liquid containing activating chemical compounds to specific areas of a dielectric substrate, followed by electromagnetic radiation to bind these compounds to the substrate surface, allowing for selective activation without the need for unspecific introduction into the substrate material or application/removal of layers, enabling efficient and cost-effective metallization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If activating chemical compounds are introduced unspecifically into the entire substrate material, then activation can be achieved, but material costs increase and recycling becomes complex

Engineering Contradiction:
Improveactivation effectivenessVSAvoidmaterial costs and recycling difficulty
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

The patent applies activating chemical compounds only to specific local areas of the substrate surface where activation is needed, rather than throughout the entire substrate. This is achieved by applying the liquid containing activating compounds selectively to the areas to be activated, thereby reducing material consumption and simplifying recycling while maintaining effective activation where required.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If a coating layer is applied over the entire substrate surface and then removed, then selective activation is achieved, but technological effort and process complexity increase

Engineering Contradiction:
Improveselective activation accuracyVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent extracts the activating compounds from a hypothetical full-surface coating approach and applies them directly only to the specific areas needing activation. This eliminates the unnecessary steps of applying and removing a full-surface coating, reducing process complexity while maintaining the ability to achieve selective activation with high precision.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent performs preliminary application of the liquid containing activating compounds only to the specific areas that will be activated, before the electromagnetic radiation step. This preliminary selective application avoids the need for subsequent removal operations and simplifies the overall process while ensuring precise activation locations.

Inventive Principle:
Principle #10Preliminary action

3Loss of substance

If activating compounds are applied to specific areas, then material costs are reduced, but activation efficiency may decrease

Engineering Contradiction:
Improvematerial cost reductionVSAvoidactivation efficiency
Core Design Contradiction:
Loss of substanceVSProductivity

Solution Approach 1:

The patent uses a liquid application method (hydraulic approach) to deliver the activating compounds to the specific areas needing activation. This liquid application can be precisely controlled to ensure adequate coverage and concentration in the target areas, maintaining high activation efficiency while using minimal material throughout the process.

Inventive Principle:
Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for the efficient and cost-effective selective activation of dielectric substrates, enabling the production of electronic circuits with reduced material costs and simplified processes, while maintaining the original properties of the substrate, and allows for the creation of complex electronic structures without the need for additional auxiliary layers.

Implementation Method 1

irradiation with electromagnetic radiation of an area to be activated on the surface of the substrate, by means of which the area to be activated is converted into an activated area

Methodology Applied
Scientific EffectPhotochemical reaction: Photopolymerisation

Data Source

PatentEP2906025B1Method for selective activation of at least one region of a surface of a dielectric substrate
Publication Date: 2019.05.01 ERNST ABBE HOCHSCHULE JENA
  • EP2906025B1 patent drawingFigure 1~3
  • EP2906025B1 patent drawingFigure 4~5
  • EP2906025B1 patent drawingFigure 6

AI summary

The invention relates to a method for the selective activation of a region of the surface of a dielectric substrate (1) by connecting the region with at least one activating chemical compound. In this process, a liquid (2) containing the activating chemical compound is applied to the surface of the substrate (1), and at least one region (3.1, 3.2) to be activated is irradiated with electromagnetic radiation (6) through the liquid (2). The invention further relates to a device for selective activation comprising a radiation source (5) for providing the electromagnetic radiation (6) and imaging optics (5.2) for imaging the electromagnetic radiation (6) as a focal spot (7) on a region (3.1, 3.2) to be activated.2) the surface of the substrate (1) and with at least one spray nozzle for spraying a liquid containing at least one activating chemical compound (2) at least over the extent of the focal spot (7) onto the area to be activated (3.1, 3.2).