Multilayer Dielectric Substrate Cavity Formation via Recess Lamination
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Solution Overview
Problem
The existing manufacturing method for multilayer dielectric substrates requires filling a through opening with a paste to form a hollow space, which can lead to deformation and uncertainty in forming the initially assumed hollow space during lamination and firing, affecting the substrate's radiation efficiency.
Innovation Solution
A method involving the application of a bonding material, such as metal paste, on a second dielectric substrate, followed by lamination with a first dielectric substrate having a recess, and subsequent sintering to form a cavity inside the dielectric substrate, eliminating the need for paste filling and reducing deformation risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a through opening is filled with paste to form a hollow space, then the hollow space can be formed in the multilayer dielectric substrate, but the through opening may deform during lamination and firing, affecting the radiation efficiency
Solution Approach 1:
The patent removes the through opening structure entirely and replaces it with recesses formed on the surface of dielectric substrates. By extracting the需要通过贯穿开孔形成空腔的复杂结构，the invention achieves hollow space formation without the deformation risks associated with through openings filled with paste.
Solution Approach 2:
Instead of filling a through opening to create a hollow space, the patent inverts the approach by forming recesses on the substrate surface and using bonding material between substrates to create the hollow space. This inversion eliminates the need for paste filling and through openings, directly addressing the deformation problem.
2Manufacturing precision
If paste is filled to be flush with the through opening, then the hollow space formation is improved, but additional process steps and complexity are required
Solution Approach 1:
The patent extracts the through opening structure and replaces it with surface recesses. This eliminates the need for paste filling operations and reduces manufacturing process complexity while maintaining hollow space formation precision.
Solution Approach 2:
The recesses are formed on the dielectric substrates before lamination, and the bonding material is applied in advance. This preliminary preparation simplifies the overall process by eliminating the need for paste filling during or after lamination, reducing manufacturing complexity.
3Quantity of substance
If a through opening is filled with paste, then the hollow space can be formed, but the paste filling step adds to the manufacturing complexity and time
Solution Approach 1:
By removing the through opening structure and replacing it with surface recesses, the patent eliminates the paste filling step entirely. This extraction of the problematic structure directly improves manufacturing efficiency by reducing the number of process steps required.
Solution Approach 2:
The recesses are formed and bonding material is applied before lamination, allowing the hollow space to form automatically during the bonding process. This preliminary preparation eliminates the need for subsequent paste filling operations, significantly improving productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the formation of a hollow space in multilayer dielectric substrates without paste filling, enhancing radiation efficiency and frequency bandwidth while maintaining the structural integrity of the substrate.
Implementation Method 1
the bonding material is sintered to form a cavity inside the dielectric substrate
Data Source
AI summary
A method includes after application of a bonding material, such as a metal paste, on a second dielectric substrate, a first dielectric substrate with a recess formed therein is laminated on the second dielectric substrate. Thereafter, the bonding material is sintered to form a cavity inside the dielectric substrate.