Dielectric Substrate Copper Pattern Electromagnetic Wave Suppression
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Solution Overview
Problem
Existing antenna devices face challenges in suppressing unwanted electromagnetic waves on dielectric substrates, leading to increased structure size and cost due to the need for additional components like conductive vias or radomes.
Innovation Solution
A dielectric substrate with a copper film pattern arranged on its surface, where the first dimension of the pattern is determined by the frequency and relative permittivity of the dielectric, effectively suppressing electromagnetic waves by creating opposite phases that cancel each other out, thereby reducing unwanted radiation without increasing structure size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conductive vias are arranged on the obverse surface to suppress electromagnetic waves, then electromagnetic wave suppression is improved, but the area available for control circuit configuration is reduced and module size increases
Solution Approach 1:
The invention moves the electromagnetic wave suppression structure from the obverse surface (2D plane) to the reverse surface (another dimension), allowing the obverse surface to be fully utilized for control circuits while the reverse surface handles wave suppression through strategically placed conductive vias
Solution Approach 2:
The dielectric substrate acts as an intermediary between the control circuits on the obverse surface and the conductive vias on the reverse surface, enabling both functions to coexist without direct interference while maintaining electromagnetic wave suppression effectiveness
2Object-affected harmful factors
If a radome is added to shield between transmitting and receiving antennas, then electromagnetic wave suppression is improved, but structure size and cost increase
Solution Approach 1:
The invention extracts the electromagnetic wave suppression function from the traditional radome structure and integrates it into the dielectric substrate itself through conductive via arrangements, eliminating the need for separate radome components while maintaining suppression effectiveness
Solution Approach 2:
The invention merges the substrate function with the shielding function by integrating conductive vias directly into the dielectric substrate structure, combining multiple functions into a single integrated component rather than using separate radome and substrate elements
3Object-affected harmful factors
If conductive vias are arranged on the obverse surface to suppress electromagnetic waves, then electromagnetic wave suppression is improved, but module size increases
Solution Approach 1:
By relocating conductive vias to the reverse surface, the invention utilizes the third dimension (substrate thickness) to achieve wave suppression without occupying additional planar area, thereby maintaining compact module dimensions
Solution Approach 2:
The invention segments the functional areas by placing control circuits on the obverse surface and conductive vias on the reverse surface, allowing independent optimization of each function within the same module footprint without increasing overall size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes electromagnetic wave propagation on the dielectric substrate, allowing for module miniaturization and reduced production costs by eliminating the need for additional shielding components, while maintaining effective signal transmission.
Implementation Method 1
The first dimension L of the copper film pattern 102 in a direction parallel to a propagation direction 103 of electromagnetic waves 104 that propagate on an obverse surface 105 of the dielectric 101 is given by: L＝λ0/{2×√εr}×(2n+1)……(1) where εr represents a relative permittivity of the dielectric 101, n represents an integer, and λ0 represents a free space wavelength of signals with a frequency f0
Data Source
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AI summary
A dielectric substrate for transmitting a signal with a frequency f0 includes a dielectric and a copper film pattern arranged on a first surface of the dielectric. The copper film pattern has a first dimension L in a direction parallel to a propagation direction of an electromagnetic wave that has the frequency f0 and that propagates on the first surface, and the first dimension L is given by: L=1εr−1kλ0 where εr represents a relative permittivity of the dielectric, k represents a constant in a range of 0.15 to 0.70, and λ0 represents a free space wavelength of the signal.