Dielectric Substrate EM Energy Directing Assembly

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Solution Overview

Problem

Conventional connector and backplane architectures in electronic systems introduce impedance discontinuities, degrading signal quality and integrity, especially in high-speed data transfer applications, and are prone to mechanical issues such as wear and alignment problems.

Innovation Solution

A system utilizing a dielectric substrate with an electromagnetic-energy directing assembly, including a transducer to convert RF electrical signals to EM signals, and a directing assembly with embedded conductive layers to shape and direct EM energy, reducing signal degradation and mechanical vulnerabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional mechanical connectors and backplane architectures are used to interconnect PCBs, then signal transmission between boards is enabled, but impedance discontinuities occur resulting in signal quality degradation

Engineering Contradiction:

Improvesignal integrityVSAvoidconnector architecture

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces mechanical connectors with an electromagnetic field-based wireless communication system. A transducer converts electrical signals to electromagnetic signals that propagate through a dielectric substrate, eliminating physical contact points and associated impedance discontinuities. This substitution of mechanical transmission with electromagnetic field transmission resolves the signal integrity issues caused by conventional connector architectures.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If conventional mechanical connectors are used for board interconnection, then electrical connection is established, but mechanical wear and alignment problems occur over time

Engineering Contradiction:

Improvesystem stabilityVSAvoidconnector lifespan

Core Design Contradiction:

ReliabilityVSDuration of action of moving object

Solution Approach 1:

The invention eliminates mechanical moving parts by using electromagnetic field transmission through a dielectric substrate. The transducer-based wireless communication system requires no physical contact, alignment, or mechanical wear, thereby indefinitely extending the operational lifespan and improving the long-term stability of the electronic system.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Volume of moving object

If transducer is positioned close to dielectric substrate for compact design, then space is saved, but EM energy direction and shaping becomes difficult

Engineering Contradiction:

Improveassembly compactnessVSAvoidEM energy direction

Core Design Contradiction:

Volume of moving objectVSEase of operation

Solution Approach 1:

The patent utilizes the third dimension (vertical spacing) to resolve the conflict between compactness and EM energy control. By positioning the transducer at a specific distance from the dielectric substrate rather than directly on it, the design maintains compact form factor while enabling effective electromagnetic energy direction and shaping through the substrate structure.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The dielectric substrate acts as an intermediary between the transducer and the external environment. This intermediate layer enables controlled electromagnetic energy propagation, allowing the transducer to be positioned close to the substrate while still achieving proper EM energy direction and shaping through the mediating dielectric material.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances signal integrity and stability by effectively directing EM energy, improving communication between electronic components and reducing mechanical limitations, thereby increasing the utility of high-speed data transfer systems.

Implementation Method 1

a transducer configured to convert between radio-frequency (RF) electrical signals and RF electromagnetic (EM) signals

Methodology Applied

Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Implementation Method 2

configured to direct EM energy in a region including the transducer and along a line extending away from the transducer and transverse to a plane of the major face of the dielectric substrate

Methodology Applied

Scientific EffectElectromagnetic wave propagation: Electromagnetic Induction

Data Source

PatentUS10651559B2Redirection of electromagnetic signals using substrate structures

Publication Date: 2020.05.12 MOLEX INC

AI summary

A system for transmitting or receiving signals may include a dielectric substrate having a major face, a communication circuit, and an electromagnetic-energy directing assembly. The circuit may include a transducer configured to convert between RF electrical and RF electromagnetic signals and supported in a position spaced from the major face of the substrate operatively coupled to the transducer. The directing assembly may be supported by the substrate in spaced relationship from the transducer and configured to direct EM energy in a region including the transducer and along a line extending away from the transducer and transverse to a plane of the major face.