Dielectric Substrate Mounting Package Impedance Mismatch
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Solution Overview
Problem
Conventional semiconductor device packages experience deterioration in electrical characteristics due to unnecessary inductance components and mismatched characteristic impedance, particularly at the exposed signal terminals, which are not surrounded by insulating and conductive members, leading to poor transmission efficiency and increased return loss.
Innovation Solution
The electronic component mounting package incorporates a base body with a through hole, linear metal signal terminals, and a dielectric substrate positioned between the terminals, with the dielectric substrate having a height lower than the terminals, to provide electromagnetic coupling and reduce impedance mismatch, thereby enhancing transmission characteristics and suppressing deformation-induced fluctuations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the exposed first portions of signal terminals are left uncovered, then the structure is simple and easy to manufacture, but unnecessary inductance components occur and characteristic impedance mismatches cause deterioration of electrical characteristics
Solution Approach 1:
An insulating member is introduced as an intermediary component between the exposed first portions of the signal terminals and the surrounding environment. This insulating member covers the exposed portions and provides a dielectric body between them, serving as a mediator that prevents direct exposure while maintaining the electrical functionality of the terminals.
Solution Approach 2:
The physical state and arrangement of the signal terminals are modified by covering the exposed first portions with an insulating member. This changes the electrical parameters (inductance, characteristic impedance) of the terminal structure, transforming it from an exposed state with poor electrical characteristics to a covered state with improved electrical characteristics.
2Reliability
If the exposed first portions are covered with insulating member and dielectric body, then electrical characteristics are improved, but characteristic impedance abruptly changes at bonding wire locations causing deterioration of electrical characteristics
Solution Approach 1:
The insulating member is designed with differentiated local properties: it covers the exposed first portions of the signal terminals but intentionally leaves the bonding wire locations exposed or with different insulation characteristics. This local differentiation allows the insulating member to provide electrical characteristic improvement at the terminal portions while avoiding abrupt impedance changes at the bonding wire locations.
3Speed
If larger output and enhanced speed are required for semiconductor devices, then transmission distance and communication speed are improved, but inductance components and impedance mismatch become more significant causing deterioration of electrical characteristics
Solution Approach 1:
The insulating member acts as an intermediary that stabilizes the electrical characteristics of the signal terminals, providing a consistent dielectric environment that reduces inductance components and maintains characteristic impedance. This mediation becomes increasingly important at higher transmission speeds where electrical characteristic stability is critical for maintaining signal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the transmission efficiency of high-frequency signals by reducing impedance fluctuations and cross-talk, while maintaining stable transmission characteristics and suppressing deformation-induced issues, leading to better performance in high-speed semiconductor devices.
Implementation Method 1
The dielectric substrate is provided between the first portions of the pair of signal terminals... to provide electromagnetic coupling and reduce impedance mismatch
Data Source
AI summary
An electronic component mounting package includes a dielectric substrate between first portions of a pair of signal terminals that protrude from one side in a thickness direction from a first face of a base body. This dielectric substrate has a height lower than a height of the first portions. When an electronic component is mounted, a bonding wire is connected to a tip of each of the first portions to electrically connect the first portion to the electronic component.