Dielectric Substrate Packaging for Thermally Isolated Power Dies
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Solution Overview
Problem
Conventional packaged electronic devices do not adequately isolate the power semiconductor die from the primary thermal interface, leading to potential short circuits and reduced reliability, especially in high-voltage applications.
Innovation Solution
The packaged electronic devices incorporate a dielectric substrate with a thermally conductive adhesion layer, such as a metal braze layer, to electrically isolate the power semiconductor die from the primary thermal interface, while maintaining effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the power semiconductor die is directly attached to the metal submount for heat dissipation, then heat dissipation efficiency is improved, but electrical isolation is compromised leading to potential short circuits
Solution Approach 1:
The patent introduces a dielectric substrate as an intermediary component between the power semiconductor die and the metal submount. This dielectric substrate provides both thermal conduction path and electrical isolation, serving as a mediator that resolves the contradiction between heat dissipation efficiency and electrical isolation. The dielectric substrate allows heat to flow from the die to the submount while preventing electrical short circuits.
Solution Approach 2:
The patent employs composite material structure consisting of dielectric substrate with thermally conductive adhesive layers. This composite structure combines the electrical insulation properties of dielectric materials with the thermal conduction properties of thermally conductive adhesives, achieving both electrical isolation and effective heat dissipation simultaneously.
2Reliability
If a dielectric substrate with thermally conductive adhesive layers is introduced to provide electrical isolation, then electrical isolation and reliability are improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the dielectric substrate component. The dielectric substrate simultaneously provides electrical isolation, thermal conduction, and mechanical support functions. By combining these functions into a single integrated component rather than separate layers, the structure complexity is minimized while achieving the desired electrical isolation and heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability and current carrying capacity of packaged electronic devices by preventing short circuits and ensuring reliable electrical isolation, even in high-voltage applications, without significant additional cost.
Implementation Method 1
a thermally conductive adhesion layer on an upper side of the dielectric substrate
Implementation Method 2
the thermally conductive adhesion layer comprises a metal braze layer. The metal braze layer may, for example, be directly attached to the ceramic substrate and to the lower side of the lead frame
Data Source
AI summary
A packaged electronic device comprises a power semiconductor die that comprises a first terminal and a second terminal, a lead frame comprising a lower side and an upper side that comprises a die pad region, a first lead and a second lead, wherein the first lead is integral with the lead frame and electrically connected to the first terminal of the power semiconductor die through the lead frame, a dielectric substrate, and a thermally conductive adhesion layer on an upper side of the dielectric substrate. The power semiconductor die is on the die pad region of the lead frame and the lead frame is on an upper side of the thermally conductive adhesion layer