Dielectric Substrate Support Layout for Uniform Deposition Heating
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Solution Overview
Problem
Existing electrostatic chucks in deposition chambers face challenges with temperature uniformity of substrates due to electromagnetic interference from ground potential and are prone to corrosion from cleaning gases, leading to reduced usable life.
Innovation Solution
A substrate support made of dielectric material with embedded features such as a graphite foil, a thermally conductive mesh, and a center tap structure, along with a support arm housing a ground cable and temperature sensor, is designed to enhance temperature uniformity and protect against corrosive gases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electrostatic chuck is coupled to ground potential, then electromagnetic interference is reduced, but temperature monitoring device operation is negatively affected
Solution Approach 1:
A dielectric layer is introduced as an intermediary between the ground potential and the temperature monitoring device. This dielectric barrier allows the ground to be maintained while preventing direct electromagnetic interference with the temperature sensing elements, thus resolving the contradiction between electromagnetic shielding and temperature measurement accuracy
2Ease of operation
If an electrostatic chuck is used to hold substrates, then substrate positioning is achieved, but the hardware is corroded by cleaning gases reducing usable life
Solution Approach 1:
The electrostatic chuck is constructed using composite materials that combine dielectric and corrosion-resistant properties. The dielectric material provides the necessary electrical insulation for electrostatic chucking while being chemically resistant to corrosive cleaning gases, thus extending the usable life while maintaining substrate positioning capability
Solution Approach 2:
The design accepts that certain components may have limited lifespans due to corrosive environments and plans for periodic replacement or regeneration of the electrostatic chuck components, treating them as consumable elements that can be replaced rather than designing for indefinite service life
3Device complexity
If the substrate support structure is simplified, then device complexity is reduced, but protection against corrosive gases is compromised
Solution Approach 1:
A thin dielectric film or coating is applied to the substrate support structure, providing corrosion protection without significantly increasing structural complexity. This thin barrier layer protects against corrosive gases while maintaining the simplicity of the overall support design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate support achieves improved temperature uniformity across the substrate, minimizes electromagnetic interference, and extends the lifespan of the support by shielding it from corrosive cleaning gases.
Implementation Method 1
the body comprising a dielectric material... improved temperature uniformity across the substrate
Implementation Method 2
the electromagnetic energy from the ground may negatively affect temperature monitoring device operation... minimizes electromagnetic interference
Implementation Method 3
An electrostatic chuck, or an ESC, is typically utilized to hold a substrate on a substrate support
Data Source
AI summary
The present disclosure generally relates to a substrate support that includes a body having a substrate receiving surface, the body comprising a dielectric material. The body also includes a first foil embedded in the body below the substrate receiving surface. The body also includes an electrically conductive mesh embedded in the body below the first foil. The body also includes a center tap structure formed in a bottom surface of the body that is in electrical communication with the mesh.