Dielectric Surface Patterns for Hybrid Bonding Strength
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Solution Overview
Problem
Current semiconductor device manufacturing faces challenges in increasing surface area, bond strength, and alignment during fusion and hybrid bonding of stacked dies, which are essential for creating smaller, faster, and more powerful devices with higher component density.
Innovation Solution
The implementation of semiconductor devices with surface patterns featuring recesses and protrusions on dielectric layers, where the protrusions on one die align vertically with corresponding recesses on another, enhancing surface area and bond strength through conventional semiconductor manufacturing techniques such as etching and deposition methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional flat dielectric surfaces are used for bonding, then the manufacturing process is simple, but the surface area and bond strength are limited
Solution Approach 1:
The dielectric surface is segmented into multiple recesses and protrusions instead of remaining flat. This segmentation increases the effective bonding surface area while maintaining compatibility with conventional semiconductor manufacturing processes through etching and deposition techniques
Solution Approach 2:
The bonding interface transitions from a two-dimensional flat surface to a three-dimensional structured surface with recesses and protrusions. This dimensional change increases the bonding surface area and enhances mechanical interlocking between stacked dies, thereby improving bond strength
2Area of stationary object
If stacked dies are used to increase capacity, then device footprint is reduced, but alignment precision during bonding becomes more critical
Solution Approach 1:
The recesses and protrusions are formed in advance during dielectric layer processing, creating a self-aligning mechanism that compensates for minor misalignments during stacking. This pre-formed structure provides mechanical guidance that eases the alignment requirement compared to flat surface bonding
3Area of moving object
If surface area is increased through patterning, then bond strength improves, but manufacturing process complexity increases
Solution Approach 1:
The recesses and protrusions are formed as preliminary structures during the dielectric layer fabrication process, before the actual bonding operation. This preliminary action integrates the surface area enhancement into existing manufacturing flows, avoiding the need for separate complex patterning steps
Data Source
AI summary
A semiconductor device includes a semiconductor substrate having a first major surface and a second major surface opposite the first major surface, a first layer of dielectric material over the first major surface, and a second layer of dielectric material over the second major surface. The first layer includes a plurality of recesses, and the second layer includes a plurality of protrusions. Each of the plurality of recesses are defined by a shape, and each of the plurality of protrusions are vertically aligned with a corresponding one of the plurality of recesses and are defined by the shape of the corresponding one of the plurality of recesses.