Thermally Conductive Dielectric Tape for Heat Dissipation
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Solution Overview
Problem
Conventional electrical insulation materials, such as mica tapes, are thermally insulating, which reduces the efficiency and durability of electrical equipment due to inadequate heat dissipation, while also being inflexible and not applicable to a wide range of industries.
Innovation Solution
A thermally conductive dielectric layer sandwiched between two glass carrier layers, utilizing mica particles and thermally conductive, electrically insulative filler particles like ZnO, BeO, and SiC, with a polymeric binder, to create a versatile insulation tape that balances electrical insulation with improved heat conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical insulation materials like mica tapes are used, then electrical insulation properties are improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent creates a composite material combining mica particles (for electrical insulation) with thermally conductive filler particles (for heat dissipation) in a polymeric binder. This composite structure allows simultaneous achievement of high electrical insulation and improved thermal conductivity, resolving the contradiction between these two properties.
Solution Approach 2:
The invention applies different material properties to different components of the tape: mica particles provide electrical insulation in the dielectric layer, while thermally conductive filler particles provide heat dissipation pathways. This local differentiation of material functions allows the single tape structure to satisfy both electrical and thermal requirements simultaneously.
2Reliability
If multiple thin layers of mica tape are wrapped about the coil to provide high voltage insulation, then electrical insulation is improved, but device complexity and heat dissipation complications increase
Solution Approach 1:
The patent combines multiple functions into a single insulating tape layer: electrical insulation from mica particles, thermal conductivity from filler particles, and mechanical strength from the polymeric binder and glass carrier layers. This consolidation reduces the number of separate insulation layers needed, simplifying the overall insulation system while maintaining high voltage insulation performance.
3Volume of moving object
If conventional insulating materials are used to reduce equipment size, then compactness is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent changes the thermal parameter of the insulating material by incorporating thermally conductive filler particles with specific thermal conductivity characteristics. This parameter modification allows the material to maintain electrical insulation properties while achieving improved heat dissipation, enabling compact equipment design without thermal management compromises.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a tape with enhanced thermal conductivity without compromising electrical insulation, mechanical strength, and flexibility, making it suitable for various applications by ensuring effective heat dissipation and maintaining performance across different voltage requirements.
Implementation Method 1
thermally conductive, electrically insulative filler particles like ZnO, BeO, and SiC
Implementation Method 2
electrically insulative filler particles
Data Source
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Figure 2
AI summary
An electrical insulation tape that has a first and second carrier layer, and a dielectric thermally conductive, electrically insulative filler layer (24) that has mica particles/flakelets (6), filler particles (26) and a binder resin (28), disposed between the first and second carrier layers. The dielectric filler layer has mica flakelets (30), filler particles (32) and a binder resin. The ratio of mica flakelets to filler particles is at least 1:1 by volume, and the percentage of binder resin in the dielectric filler layer is 35-50% by volume. The first and second carrier layers are impregnated with a second resin.