Dielectric Layer Thinning for Thin Reliable Communication Modules
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Solution Overview
Problem
Communication devices face challenges in achieving thinness and reliability while ensuring effective signal transmission, particularly in flexible or bendable designs.
Innovation Solution
A manufacturing method involving a dielectric layer with varying thickness regions and a sealing element to combine substrates, followed by selective thinning and separation, allows for the integration of communication and control elements without damaging them, enhancing signal transmission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the dielectric layer is thinned to achieve thinness in communication devices, then the device thickness is reduced, but signal transmission quality deteriorates due to increased signal attenuation
Solution Approach 1:
The dielectric layer is designed with different thicknesses in different regions: a first thickness in the first region (where communication elements are located) and a second thickness in the second region. This local variation allows the dielectric layer to be thinner where signal transmission is critical while maintaining sufficient thickness in other areas to prevent signal attenuation and damage to communication elements during manufacturing.
2Length of moving object
If the dielectric layer is uniformly thinned to reduce device thickness, then the device becomes thinner, but communication elements may be damaged during the thinning process
Solution Approach 1:
The dielectric layer has a first thickness in the first region and a second thickness in the second region, where the first thickness is less than the second thickness. This local thickness variation protects communication elements during the thinning process by maintaining greater dielectric material coverage in areas where elements are located, while still achieving overall device thinness.
3Reliability
If a uniform thick dielectric layer is used to protect communication elements, then element reliability is improved, but the overall device thickness increases
Solution Approach 1:
The dielectric layer is configured with a first thickness in the first region and a second thickness in the second region, where the first thickness is less than the second thickness. This allows the device to achieve thinness overall while maintaining sufficient dielectric thickness in specific regions to protect communication elements and ensure their reliability.
4Manufacturing precision
If the dielectric layer is thinned after combining substrates, then manufacturing precision is improved, but the complexity of the manufacturing process increases due to additional steps
Solution Approach 1:
The dielectric layer is formed with different thicknesses in different regions before the substrates are combined. This preliminary thickness variation is built into the dielectric layer formation process, allowing subsequent thinning operations to be performed with greater precision while avoiding the need for complex post-assembly thickness adjustments.
Data Source
AI summary
This disclosure provides a communication device and a manufacturing method thereof. The manufacturing method of the communication device includes the following steps: providing a first dielectric layer, wherein the first dielectric layer includes a first region and a second region, and the first dielectric layer has a first surface and a second surface opposite to the first surface; providing a second dielectric layer; combining the first dielectric layer and the second dielectric layer with a sealing element, so that the sealing element is disposed between the first surface of the first dielectric layer and a third surface of the second dielectric layer; after combining the first dielectric layer and the second dielectric layer, thinning the second surface of the first dielectric layer; and disposing a first communication element on the first surface of the first dielectric layer in the first region.