Dielectric Two-Phase Heat Transfer for Transformer Cooling
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Solution Overview
Problem
Conventional transformer assemblies face heat management issues due to compact designs, leading to reduced performance and reliability, with active cooling systems being prone to failure and traditional heat sinks causing magnetic losses and induced voltages.
Innovation Solution
A passive, flexible dielectric two-phase heat transfer device is integrated into the transformer assembly, comprising an evaporator region coupled to the hot components and a condenser region connected to a heat dissipation member, fabricated from dielectric materials like PEEK, which uses phase changes to enhance thermal conductivity without moving parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active cooling systems with cooling fluid are used, then cooling effectiveness is improved, but system reliability deteriorates due to multiple components that can fail
Solution Approach 1:
The patent removes the cooling fluid from the heat transfer device, extracting the problematic element that caused reliability issues. The hollow cavity is filled with dielectric material instead of liquid cooling fluid, eliminating leakage and component failure risks while maintaining heat transfer capability through phase change of the dielectric material.
Solution Approach 2:
The patent replaces the mechanical active cooling system with moving parts (pumps, valves, cooling fluid circulation) with a passive heat transfer device using phase change of dielectric material. This substitution eliminates mechanical components that can fail, improving reliability while maintaining cooling effectiveness.
2Temperature
If traditional metallic heat sinks and heat pipes are used, then heat dissipation is improved, but magnetic losses and induced voltages increase
Solution Approach 1:
The patent changes the material parameter from metallic to dielectric material. This fundamental parameter change eliminates the harmful electromagnetic effects (eddy currents, induced voltages, magnetic losses) while maintaining the heat dissipation function through the phase change mechanism of the dielectric material.
Solution Approach 2:
The patent uses composite construction with dielectric material filling the hollow cavity, combining the heat transfer capability with electromagnetic isolation properties. The dielectric material serves dual purposes: heat transfer through phase change and elimination of magnetic losses and induced voltages.
3Volume of moving object
If compact transformer assembly design is implemented, then device size is reduced, but heat concentration increases affecting nearby components
Solution Approach 1:
The patent merges the heat transfer function directly into the transformer assembly structure by integrating the heat transfer device with the bobbin or core. This integration allows efficient heat removal from compact components without requiring separate cooling systems, enabling compact design while managing heat concentration.
Solution Approach 2:
The patent utilizes phase transitions (melting and solidification) of the dielectric material to achieve high heat transfer coefficients in a compact form factor. The phase change mechanism provides intense cooling capability within the limited space of compact transformer assemblies, preventing heat concentration issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively cools transformer assemblies by utilizing phase changes in a dielectric heat transfer device, increasing thermal conductivity and reliability while avoiding magnetic interference and induced voltages, thus enhancing the performance and longevity of the transformer assemblies.
Implementation Method 1
The flexible dielectric heat transfer device is a two-phase heat transfer device that utilizes phase changes to enhance thermal conductivity
Implementation Method 2
The dielectric heat transfer device includes an evaporator region coupled in thermal communication with a hot region of a heat producing component
Implementation Method 3
The dielectric heat transfer device includes a condenser region coupled in thermal communication with the heat dissipation member
Implementation Method 4
The dielectric two-phase heat transfer device is fabricated from a dielectric material... utilizes phase changes to enhance thermal conductivity
Data Source
AI summary
Methods and apparatuses for cooling an electronic device assembly having a heat producing are described. An electronic device assembly includes a heat dissipation member and a dielectric two-phase heat transfer device. The dielectric heat transfer device has an evaporator region thermally attached to a hot region of the heat producing component and a condenser region thermally attached to the heat dissipation member. The dielectric two-phase heat transfer device is fabricated from a dielectric material.