Dielectric Waveguide Channel for High-Speed Interconnects
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Solution Overview
Problem
Existing interconnect solutions for packages in computational systems, such as top-side interconnects, introduce signal attenuation and require connectors or sockets, which increase complexity and cost.
Innovation Solution
The use of waveguides directly built on or assembled with package substrates, eliminating the need for connectors and allowing for direct, low-loss high-speed connectivity between packages through a dense waveguide fabric, using materials like PTFE-based or LCP-based dielectric materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If top-side interconnects are used to interconnect packages, then connectivity between packages is achieved, but signal attenuation increases and device complexity increases due to required connectors and sockets
Solution Approach 1:
The patent extracts and eliminates the intermediate connectors and sockets from the signal path by implementing direct waveguide-to-die coupling. The waveguide is directly assembled with the package substrate, removing the need for separate connector components and reducing the number of interface points where signal degradation occurs.
Solution Approach 2:
The waveguide assembly is merged directly with the package substrate through direct assembly techniques. The waveguide channel is positioned in direct alignment with the die, eliminating the need for separate connector components and creating an integrated signal path that reduces complexity and improves signal integrity.
2Ease of manufacture
If top-side interconnects with connectors and sockets are used, then package interconnection is achieved, but manufacturing complexity and cost increase due to alignment requirements
Solution Approach 1:
The waveguide is pre-assembled with the package substrate in a fixed, predetermined position during the packaging process. This preliminary assembly establishes the correct alignment before the die is attached, eliminating the need for subsequent alignment operations and reducing manufacturing precision requirements.
Solution Approach 2:
The waveguide assembly structure provides self-alignment features that automatically position the waveguide channel in correct registration with the die. The mechanical structure of the package substrate and waveguide assembly work together to ensure proper alignment without requiring external alignment tools or complex positioning procedures.
3Reliability
If traditional interconnect solutions are used, then package connectivity is achieved, but signal path disruptions increase causing higher attenuation
Solution Approach 1:
The waveguide provides a continuous electromagnetic signal path from the die to external connectors or other packages. The dielectric waveguide channel maintains uninterrupted signal propagation without the discontinuities introduced by traditional connector interfaces, preserving signal energy and reducing attenuation.
Solution Approach 2:
The patent replaces mechanical connector interfaces with an electromagnetic waveguide system. Instead of using physical contact points and mating connectors that disrupt the signal path, the electromagnetic field propagates continuously through the dielectric waveguide channel, eliminating mechanical interface losses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces signal attenuation, simplifies manufacturing, and lowers costs by eliminating the need for connectors and alignment efforts, while enabling high-speed signal transmission with minimal disruptions in the signal path.
Implementation Method 1
a waveguide channel positioned between two layers of the two or more layers of the dielectric material, wherein the waveguide channel is to convey an electromagnetic signal with a frequency greater than 30 gigahertz (GHz)
Data Source
AI summary
Embodiments may relate to a semiconductor package that includes a package substrate coupled with a die. The package may further include a waveguide coupled with the first package substrate. The waveguide may include two or more layers of a dielectric material with a waveguide channel positioned between two layers of the two or more layers of the dielectric material. The waveguide channel may convey an electromagnetic signal with a frequency greater than 30 gigahertz (GHz). Other embodiments may be described or claimed.