Dielectric Waveguide Interconnection Assembly for High-Density Server Rooms
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Solution Overview
Problem
Current interconnection methods for data transfer between electronic devices in server rooms, such as switches and servers, face challenges with signal degradation and power loss due to the high cost and inefficiency of optical transmission lines, particularly the expensive SFP-Modules required for each line.
Innovation Solution
An interconnection assembly utilizing dielectric waveguides with a core made from a first dielectric material surrounded by a second dielectric material of lower refractive index, combined with a fan-out element and connector parts featuring hollow conductors to guide signals between antennas and cables, minimizing signal degradation and power loss while allowing precise positioning for high-density signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical transmission lines with SFP-Modules are used for data transfer, then signal transmission quality is improved, but cost increases significantly
Solution Approach 1:
The patent replaces expensive optical transmission lines with inexpensive dielectric waveguide cables. These cables use simple dielectric materials (plastic or ceramic cores with polymer cladding) instead of costly optical components, achieving comparable signal transmission quality at a fraction of the cost while maintaining sufficient performance for data center applications
Solution Approach 2:
The patent changes the transmission medium from optical fibers requiring SFP-Modules to dielectric waveguides operating at different frequency ranges. By adjusting the dielectric properties and geometric parameters of the waveguide structure, the system achieves optimal signal transmission without requiring expensive optical transceivers
2Ease of manufacture
If dielectric waveguide cables are used for signal transmission, then cost is reduced, but signal degradation and power loss increase
Solution Approach 1:
The patent employs composite dielectric structures with a core made from one dielectric material surrounded by a cladding layer of another dielectric material with different refractive index. This layered composite structure minimizes signal degradation through controlled impedance matching and reduced reflection, while maintaining the cost advantages of dielectric materials
Solution Approach 2:
The patent uses funnel-shaped connector ports with curved transition geometries to gradually couple signals between antennas and cable cores. This curved transition design reduces signal reflection and impedance discontinuities, thereby minimizing signal degradation and power loss at connection points
3Productivity
If high-density antenna and cable positioning is implemented, then productivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent transitions from planar antenna arrangements to three-dimensional stacked configurations with multiple layers. By utilizing vertical spacing and multi-level positioning, the system achieves high packing density without requiring extremely tight lateral tolerances, thereby reducing manufacturing precision requirements while maintaining high productivity
Solution Approach 2:
The patent divides the antenna array into multiple modular connector parts, each handling a subset of antennas and cables. This segmentation allows for modular assembly with relaxed tolerance accumulation, enabling high-density positioning through repeated modular units rather than requiring precision across the entire assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables robust and precise signal transmission with minimal signal degradation and power loss, achieving high packing density of antennas and cables, especially at high signal frequencies, and reduces costs compared to fiber optic solutions.
Implementation Method 1
a cable with a core made from a first dielectric material, wherein the cable core is at least partially surrounded by a second dielectric material having a different, preferably lower, refractive index than the first dielectric material
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
Interconnection assembly (1) for a switching device in a server room comprising a. at least one cable (5) with a core (6) comprising a first dielectric material, wherein said core is at least partially surrounded by a second dielectric material having a refractive index different from the first dielectric material; b. a first connector part (9) positioned with respect to at least one antenna (4) comprising i. a fan-out element comprising per antenna at least one hollow conductor (10c, 11c) arranged between the at least one antenna (4) and the core (6) of the at least one cable (5), ii. said at least one hollow conductor ( 10c, 11c) extending in the fan- out element to guide a signal between the at least one antenna (4) and the core (6) of the at least one cable (5), iii. said hollow conductor (10c, 11c) having a first port (10a, 11a) aligned with the at least one antenna (4) and a second port (18), which in an assembled position is in communication with the core (6) of the at least one cable (5); c. at least one second connector part (19) interconnected to the at least one cable (5) positioning the core (6) of the cable (5) in a connected position with respect to the second port (18) of the hollow conductor (10c, 11c).