Embedded Dielectric Waveguide for Lower-Frequency PCB Signal Transmission
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Solution Overview
Problem
Component carriers face challenges in providing efficient and reliable electromagnetic signal transmission in compact, robust, and design-flexible manners, especially with increasing miniaturization and the need to handle lower frequencies without increasing waveguide size.
Innovation Solution
A component carrier with a cavity embedded in a metallic shielding structure and a dielectric element with a high dielectric constant, allowing efficient signal transmission and size reduction by embedding the dielectric element within the waveguide.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If tunnel structures with metallic sidewalls (waveguides) are used for electromagnetic signal transmission, then high frequency transmission is improved, but the size of the waveguides must increase when operation frequency is lowered
Solution Approach 1:
The patent applies parameter changes by introducing a dielectric element with high dielectric constant (Dk ≥ 2) into the waveguide cavity. This changes the electromagnetic parameters of the transmission medium, allowing lower frequency operation without increasing waveguide dimensions. The dielectric constant parameter modification enables compact waveguide design across a broader frequency range.
Solution Approach 2:
The patent employs composite materials by combining metallic shielding structures with dielectric elements (such as ceramic materials) within the waveguide cavity. This composite structure leverages the conductive properties of metal for shielding and the high dielectric constant of ceramic materials for frequency control, achieving both compact size and reliable signal transmission.
2Productivity
If electronic components are miniaturized and densely mounted on component carriers, then product functionality and integration are improved, but heat removal becomes increasingly difficult
Solution Approach 1:
The dielectric element serves as an intermediary thermal management component within the component carrier structure. It provides thermal pathways and heat distribution mechanisms that enable effective heat removal from densely packed electronic components, addressing thermal challenges without compromising integration density.
3Reliability
If component carriers are designed to be mechanically robust under harsh conditions, then reliability is improved, but design flexibility may be reduced
Solution Approach 1:
The patent segments the component carrier into functional modules including metallic shielding structures, dielectric elements, and cavity structures. This segmentation allows each component to be optimized for its specific function (mechanical strength, electromagnetic performance, thermal management) while maintaining overall design flexibility through modular assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient transmission of lower frequencies without size increase, achieving a 30-40% size reduction and maintaining robustness, while being manufacturable with standard PCB processes for straightforward integration into existing production lines.
Implementation Method 1
the dielectric element comprises a material having a dielectric constant, Dk, of two or more
Data Source
Figure 1~7
AI summary
There is described a component carrier (100), comprising: i) a stack (101) comprising at least one electrically insulating layer structure (102) and/or at least one electrically conductive layer structure (104); ii) a cavity (120), at least partially provided in the stack (101) and delimited by a plurality of sidewalls (121), iii) a metallic shielding structure (125) in the cavity (120), wherein the metallic shielding structure (125) at least partially covers the plurality of sidewalls (121); and iv) a dielectric element (150) arranged in the cavity (120), wherein the dielectric element (150) comprises a material having a dielectric constant, Dk, of two or more.