Dielectric Waveguide Interconnects for Low-Latency mmWave Links

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Solution Overview

Problem

Conventional interconnect technologies, such as baseband copper cables or optical communication components, fail to achieve low latency, low cost, and low power for high data-rate communication, particularly in applications like deep learning, autonomous vehicle management, and virtual/augmented reality.

Innovation Solution

The use of dielectric waveguides, waveguide bundles, waveguide connectors, and transmission line structures enables high data-rate millimeter-wave communication in a dense, low-latency, and power-efficient manner by eliminating metal cladding or coatings, which reduces signal attenuation and crosstalk, and employs absorber materials and varying waveguide diameters to compensate for dispersion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional interconnect technologies (copper cables or optical components) are used, then existing infrastructure can be maintained, but low latency, low cost, and low power for high data-rate communication cannot be achieved

Engineering Contradiction:
Improvedata-rate communication capabilityVSAvoidlatency
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The patent replaces conventional copper electrical signaling and optical communication components with a dielectric waveguide system using millimeter-wave electromagnetic signals. This substitution enables higher data rates and lower latency by utilizing waveguide physics rather than conventional electrical or optical interconnect mechanisms

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the operating frequency parameter to millimeter-wave range and modifies the transmission medium parameters by using dielectric materials with specific properties (loss tangent, dielectric constant) to achieve optimal signal propagation characteristics for high-speed communication

Inventive Principle:
Principle #35Parameter changes

2Strength

If metal cladding or coatings are used in waveguides, then structural integrity is maintained, but signal attenuation and crosstalk increase

Engineering Contradiction:
Improvewaveguide structural integrityVSAvoidsignal attenuation
Core Design Contradiction:
StrengthVSLoss of energy

Solution Approach 1:

The patent extracts and removes the metal cladding or coatings from the waveguide structure, retaining only the dielectric core material. This extraction eliminates the harmful interaction between metal and high-frequency signals that causes attenuation and crosstalk, while the dielectric material alone provides sufficient structural integrity

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention applies different material properties to different regions: the core uses dielectric material optimized for low-loss millimeter-wave propagation, while the overall waveguide structure maintains mechanical strength through its geometric configuration and dielectric material properties rather than relying on metal cladding

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If uniform waveguide diameter is used, then manufacturing is simplified, but dispersion compensation is insufficient

Engineering Contradiction:
Improvewaveguide fabrication simplicityVSAvoidsignal integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies different diameter specifications to different sections of the waveguide based on their functional requirements. Sections require different diameters to compensate for dispersion effects, with each section's dimensions optimized for its specific role in maintaining signal integrity across the transmission path

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The waveguide diameter is made variable along the transmission path rather than uniform, allowing the structure to dynamically adapt to compensation requirements for different signal frequencies and propagation distances, thereby maintaining signal integrity

Inventive Principle:
Principle #15Dynamics

4Loss of energy

If dielectric waveguides without metal cladding are used, then signal attenuation and crosstalk are reduced, but manufacturing precision requirements increase

Engineering Contradiction:
Improvesignal attenuationVSAvoidwaveguide dimensional tolerance
Core Design Contradiction:
Loss of energyVSManufacturing precision

Solution Approach 1:

The patent specifies optimized parameter ranges for dielectric materials (loss tangent, dielectric constant) and waveguide dimensions that balance low signal attenuation with achievable manufacturing tolerances. These parameter selections make high-performance dielectric waveguides manufacturable with standard precision capabilities

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach achieves adequate bandwidth density, reduces crosstalk, and maintains signal integrity at high data rates beyond 100 gigabits per second, overcoming the limitations of conventional technologies while minimizing complex and expensive integration.

Implementation Method 1

components for millimeter-wave communication... dielectric waveguides... enables high data-rate millimeter-wave communication

Methodology Applied
Scientific EffectElectromagnetic wave propagation: Electromagnetic Induction

Implementation Method 2

employs absorber materials and varying waveguide diameters to compensate for dispersion

Methodology Applied
Scientific EffectElectromagnetic absorption: Absorption (EM radiation)

Data Source

PatentUS12166261B2Components for millimeter-wave communication
Publication Date: 2024.12.10 INTEL CORP
  • US12166261B2 patent drawing
  • US12166261B2 patent drawing
  • US12166261B2 patent drawing

AI summary

Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.