Dielectric Waveguide PCB for High-Speed Signal Containment

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Solution Overview

Problem

High-speed data transmission over short distances using differential signaling is limited by noise and radiated emissions, while fiber optics, though capable of higher speeds, requires expensive and bulky optical transmitters and receivers.

Innovation Solution

A multi-layer printed circuit board (PCB) incorporating a dielectric waveguide with a core and cladding, where the core has a higher dielectric constant than the cladding, allowing electromagnetic signals to be internally reflected and contained, coupled with coaxial vias for signal transmission and reception, thereby avoiding the need for optical components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If differential signaling is used for short high speed buses, then noise and radiated emissions are reduced, but transmission distance is limited

Engineering Contradiction:
Improvenoise and radiated emissionsVSAvoidtransmission distance
Core Design Contradiction:
Object-affected harmful factorsVSLength of stationary object

Solution Approach 1:

The patent replaces traditional electrical differential signaling with electromagnetic wave propagation through a dielectric waveguide. This substitution enables the signal to travel as an electromagnetic wave rather than a electrical signal, fundamentally changing the transmission mechanism and enabling longer distances while maintaining noise immunity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the transmission medium from standard PCB traces to a dielectric waveguide with specific dielectric constant parameters (core: 2.2-3.5, cladding: 1.4-2.0). This parameter change allows the structure to guide electromagnetic waves effectively, extending transmission distance while maintaining the benefits of differential signaling.

Inventive Principle:
Principle #35Parameter changes

2Speed

If fiber optics is used for high speed data transmission, then transmission speed and distance are improved, but device cost and size increase

Engineering Contradiction:
Improvedata transmission speedVSAvoidoptical transmitters and receivers
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent uses standard PCB materials (dielectric layers with specific constants) instead of expensive optical components. The dielectric waveguide is fabricated using conventional PCB manufacturing processes, making it a cost-effective alternative to fiber optics while achieving similar performance benefits.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The dielectric waveguide structure serves multiple functions: it guides electromagnetic waves, provides differential signaling, and can be integrated into standard PCB manufacturing. This multi-functionality eliminates the need for separate optical transmitters and receivers, reducing device complexity while maintaining high-speed transmission capabilities.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables high-speed data transmission (above 70 Gb/s) over longer distances with reduced noise and without the need for expensive optical transmitters and receivers, providing a cost-effective and compact solution for high-speed communication channels.

Implementation Method 1

a dielectric waveguide with a core and cladding, where the core has a higher dielectric constant than the cladding, allowing electromagnetic signals to be internally reflected and contained

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS10199706B2Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planes
Publication Date: 2019.02.05 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US10199706B2 patent drawing
  • US10199706B2 patent drawing
  • US10199706B2 patent drawing

AI summary

Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide sandwiched between two ground layers. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core.