Dielectric Waveguide Radio Interconnects for High-Speed Chip Communication
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Solution Overview
Problem
The speed of communication between chip packages in high-performance computing systems is limited by the numerous interfaces required for signal transmission through sockets and motherboards, leading to reduced data rates and increased physical space requirements.
Innovation Solution
Implementing a millimeter-wave wireless interconnect using dielectric waveguides that couple radio transceivers directly to chip packages, eliminating the need for mechanical connectors and allowing for high-data-rate connections over longer distances without significant package size increase, and reducing thermal and alignment issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If copper interconnects through sockets and motherboards are used for chip communication, then physical connections are established, but data rate is limited and physical space requirements increase
Solution Approach 1:
The patent replaces mechanical copper interconnects and socket interfaces with a wireless electromagnetic field-based communication system. Radio transceivers mounted on chip packages communicate through electromagnetic waves, eliminating the need for physical copper traces, sockets, and motherboards, thereby increasing data rates and reducing interface complexity
Solution Approach 2:
The patent introduces radio transceivers as intermediary devices that convert electrical signals from chips into electromagnetic waves for transmission. These transceivers act as mediators between the chip and the communication channel, enabling high-speed wireless communication without direct physical interconnects
2Speed
If flex cables with multiple parallel conductors are used to bypass sockets, then data rate improves, but package size and thermal issues increase
Solution Approach 1:
The patent replaces physical flex cables with wireless electromagnetic field transmission. This eliminates the need for dense parallel conductors that generate heat, as the communication occurs through electromagnetic waves in free space or waveguides, significantly reducing thermal impact while maintaining high data rates
3Length of stationary object
If optical interconnects are used for longer distances, then communication distance increases, but precision alignment requirements increase
Solution Approach 1:
The patent changes the communication parameter from optical wavelengths requiring precise alignment to radio frequency electromagnetic waves with longer wavelengths. This parameter change allows for relaxed alignment tolerances while maintaining communication over longer distances, as radio waves are less sensitive to misalignment and can traverse obstacles more effectively
4Speed
If waveguides are used for radio communication, then data rate increases, but package size may increase
Solution Approach 1:
The patent transitions communication from two-dimensional planar traces on substrates to three-dimensional waveguide structures. These waveguides can be routed through the package volume in multiple dimensions, allowing high-speed radio frequency transmission without increasing the package's external footprint, as the waveguides utilize the internal volume efficiently
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables higher data rates and smaller package sizes while minimizing thermal impact and eliminating precision alignment requirements, allowing signals to traverse obstacles and providing scalable data rates up to Terabit per second.
Implementation Method 1
a radio on the package substrate to modulate data from the chip onto a carrier and to transmit the modulated data
Implementation Method 2
a waveguide connector coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide to carry the modulated data
Data Source
AI summary
Microelectronic package communications are described that use radio interfaces that are connected through waveguides. One example includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, and a radio on the package substrate coupled to the radio chip to modulate the data over a carrier and to transmit the modulated data. A waveguide connector is coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide carries the modulated data to an external component.