Dielectric Waveguide Connection Structure with Local Recesses

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Solution Overview

Problem

The existing connection structures for dielectric waveguide lines, particularly in the sub-terahertz band, face challenges with high transmission loss and mechanical strength due to the limitations of materials like LTCC and resin substrates, and the difficulty in forming via holes in quartz substrates, which are necessary for efficient high-frequency signal transmission.

Innovation Solution

A connection structure between a dielectric waveguide line and a waveguide is developed, featuring a dielectric substrate with recesses and through conductor groups spaced at half or less of the guide wavelength, allowing for efficient signal transmission while maintaining mechanical strength by forming a local recess without thinning the entire substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If the entire substrate is thinned to improve transmission characteristics, then transmission loss is reduced, but mechanical strength is compromised

Engineering Contradiction:

Improvetransmission lossVSAvoidmechanical strength

Core Design Contradiction:

Loss of energyVSStrength

Solution Approach 1:

The patent applies local quality by forming recesses only in specific regions where transmission optimization is needed, rather than thinning the entire substrate. This allows the substrate to maintain its mechanical strength while achieving improved transmission characteristics in the critical coupling area through localized geometric modification.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The substrate is segmented into different regions with different thicknesses - the recessed regions have reduced thickness for optimal transmission, while the non-recessed regions maintain full thickness for mechanical support. This segmentation allows simultaneous optimization of both transmission performance and structural integrity.

Inventive Principle:

Principle #1Segmentation

2Reliability

If via holes are formed in quartz substrate to improve connectivity, then signal transmission is enhanced, but manufacturing difficulty increases

Engineering Contradiction:

Improvesignal transmissionVSAvoidvia hole formation

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent extracts the via hole formation step entirely by using a planar dielectric waveguide line structure with conductor layers and recesses. This alternative approach achieves the same connectivity function without requiring complex via hole drilling and filling processes in the quartz substrate, thereby maintaining manufacturing feasibility.

Inventive Principle:

Principle #2Taking out (Extraction)

3Loss of energy

If resin substrate is used to reduce loss, then transmission loss decreases, but dimensional accuracy and rigidity deteriorate

Engineering Contradiction:

Improvetransmission lossVSAvoiddimensional accuracy

Core Design Contradiction:

Loss of energyVSManufacturing precision

Solution Approach 1:

The patent employs a composite structure combining dielectric substrate material with conductor layers and recesses. This composite approach leverages the low-loss properties of the dielectric material while using the conductor structures to provide dimensional stability and precision, effectively combining the advantages of different materials.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration achieves satisfactory transmission characteristics and ensures mechanical strength, enabling efficient high-frequency signal transmission with reduced loss and increased substrate rigidity, particularly suitable for the sub-terahertz band.

Implementation Method 1

two arrays of through conductor groups composed of a plurality of through conductors formed in a transmission direction of the dielectric waveguide line at spacings of 1/2 or less of a dielectric guide wavelength... the two arrays of through conductor groups electrically connecting the first conductor layer to the second conductor layer

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

a dielectric waveguide line including: a first dielectric substrate... a transmission region, in which the high-frequency signal propagates, being formed surrounded by the first conductor layer, the second conductor layer, and the two arrays of through conductor groups

Methodology Applied

Scientific EffectDielectric guidance: Dielectric

Data Source

PatentUS11404759B2Connection structure including a coupling window between a dielectric waveguide line in a substrate and a waveguide and having plural recesses formed in the connection structure

Publication Date: 2022.08.02 NEC CORP

AI summary

A connection structure includes a dielectric waveguide line and a rectangular waveguide. The dielectric waveguide line transmits a high-frequency signal in a transmission region surrounded by a first conductor layer, a second conductor layer, and two arrays of via hole groups. A coupling window is formed in the second conductor layer. The rectangular waveguide is disposed in such a way that an open end surface of the rectangular waveguide faces the coupling window, and that the transmission direction of the dielectric waveguide line becomes orthogonal to the transmission direction of the rectangular waveguide. A plurality of recesses are formed on a first substrate surface in the vicinity of the coupling window. A recessed conductor layer electrically connected to the first conductor layer is formed on inner wall surfaces of the plurality of recesses.