Dielectric Waveguide RF Probe for Low-Loss Terahertz IC Testing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current wafer probes for testing integrated circuits above 200 GHz face challenges due to high signal loss and inflexibility in coaxial cables, and high costs and physical constraints in metallic waveguide solutions.
Innovation Solution
The use of a dielectric waveguide with embedded conducting transition members to convert RF signals into planar modes, allowing flexible and cost-effective probing of ICs, using materials like HDPE and 3D printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If coaxial cable interconnects are used for wafer probes below 200 GHz, then flexibility and ease of operation are improved, but signal loss increases and measurement precision deteriorates at frequencies above 200 GHz
Solution Approach 1:
The patent changes the fundamental parameter of the interconnect from coaxial cable to dielectric waveguide, enabling low-loss operation at frequencies above 200 GHz while maintaining flexibility through the dielectric material properties and waveguide geometry
Solution Approach 2:
The invention uses composite structures combining dielectric materials (such as PTFE or other low-loss dielectrics) with metallic components to create a waveguide that achieves both low signal loss and mechanical flexibility for probe operation
2Loss of energy
If metallic waveguide interconnects are used for wafer probes above 200 GHz, then signal loss is reduced, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent changes the interconnect type from traditional metallic waveguide to dielectric waveguide, simplifying manufacturing while achieving low-loss performance at high frequencies through dielectric material properties
Solution Approach 2:
The invention replaces complex precision-machined metallic waveguide structures with dielectric waveguides that can be manufactured using simpler techniques such as molding or 3D printing, reducing manufacturing complexity while maintaining electrical performance
3Loss of energy
If metallic waveguide interconnects are used for wafer probes above 200 GHz, then signal loss is reduced, but ease of operation deteriorates due to inflexibility
Solution Approach 1:
The patent changes the interconnect from rigid metallic waveguide to flexible dielectric waveguide, enabling movement and positioning adjustments while maintaining low signal loss at high frequencies
Solution Approach 2:
The invention uses flexible dielectric waveguide structures that can bend and move to accommodate probe station requirements, replacing inflexible metallic waveguides while maintaining electrical performance
4Measurement precision
If precision machined parts and exotic fabricated probe tips are used for waveguide input wafer probes, then measurement precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces precision machining and exotic fabrication processes with dielectric waveguide manufacturing techniques such as molding or additive manufacturing, reducing cost while maintaining measurement precision through proper dielectric material selection and geometry control
Solution Approach 2:
The invention changes the manufacturing approach from precision mechanical machining to dielectric成型 processes, enabling cost-effective production of high-precision probe structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables low-loss, flexible, and cost-effective RF probing of ICs, supporting frequencies up to 1 THz without physical constraints, and allowing bias voltage application.
Implementation Method 1
a dielectric waveguide having opposed first and second longitudinal end portions
Implementation Method 2
a conducting transition member received in the first end portion of the dielectric waveguide... that can convert a dielectric waveguide mode into a planar mode such as CPW
Implementation Method 3
Dielectric waveguide has not been used to create a probe with a (CPW) mode that is compatible with contacting and measuring planar devices
Data Source
AI summary
Radio frequency (RF) probes are shown and disclosed. In some embodiments, the RF probe includes a dielectric waveguide having opposed first and second longitudinal end portions and a planar conducting ground member being received in the first end portion of the dielectric waveguide. The conducting ground member includes an end portion with at least a first prong. The probe assembly additionally includes a conducting transition member received in the first end portion of the dielectric waveguide and spaced from the planar conducting ground member. The conducting transition member includes an end portion that includes a second prong spaced from the first prong.