Dielectric Window Cylindrical Lower Portion Plasma Uniformity
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Solution Overview
Problem
The existing dielectric windows in substrate processing systems limit the tunability and uniformity of RF power distribution in plasma, leading to issues such as global etch tilting during high aspect ratio etching due to their flat plasma-facing surfaces.
Innovation Solution
A dielectric window with a pi-shaped cross-section, comprising a flat upper portion and a cylindrical lower portion, which separates the plasma into two isolated zones, allowing for improved control and tunability of RF power distribution by aligning the outer diameter of the lower portion with the gap between inner and outer coils.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat dielectric window is used, then the structure is simple and easy to manufacture, but the RF power distribution uniformity deteriorates
Solution Approach 1:
The dielectric window incorporates a curved lower surface instead of a flat surface, creating a spherical or dome-shaped geometry that focuses and distributes RF power more uniformly across the plasma chamber. This curvature modification directly addresses the non-uniform RF power distribution problem while maintaining manufacturing feasibility through standard glass forming processes.
Solution Approach 2:
The invention transitions from a two-dimensional flat surface to a three-dimensional curved surface by adding vertical curvature to the dielectric window. This dimensional change allows the RF fields to be distributed more evenly in the vertical dimension, thereby improving overall uniformity across the plasma processing chamber.
2Manufacturing precision
If a curved dielectric window is used, then the RF power distribution uniformity is improved, but the manufacturing complexity increases
Solution Approach 1:
The dielectric window incorporates a curved lower surface instead of a flat surface, creating a spherical or dome-shaped geometry that focuses and distributes RF power more uniformly across the plasma chamber. This curvature modification directly addresses the non-uniform RF power distribution problem while maintaining manufacturing feasibility through standard glass forming processes.
Solution Approach 2:
The invention modifies the geometric parameters of the dielectric window by introducing a specific curvature radius and dome height. These parameter changes optimize the RF power distribution while allowing the use of standard manufacturing processes, thus balancing performance improvement with manufacturing simplicity.
3Manufacturing precision
If the dielectric window material is changed to improve plasma uniformity, then the processing precision is improved, but the cost and manufacturing difficulty increase
Solution Approach 1:
The invention modifies the geometric parameters of the dielectric window by introducing a specific curvature radius and dome height. These parameter changes optimize the RF power distribution while allowing the use of standard manufacturing processes, thus balancing performance improvement with manufacturing simplicity.
Solution Approach 2:
The dielectric window is constructed from a composite structure combining a curved glass dome with a metallic flange assembly. This composite design allows the glass portion to be formed using standard glass forming processes while the metal flange provides mechanical mounting features, thus maintaining ease of manufacture while achieving the desired plasma uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances plasma uniformity and tunability, reducing global etch tilting and improving processing characteristics like etching and deposition rates by physically separating the plasma into distinct zones.
Implementation Method 1
The dielectric window allows the RF signal to be transmitted from the TCP reactor coils into the interior of the processing chamber
Implementation Method 2
The RF signal excites gas molecules within the processing chamber to generate plasma
Data Source
AI summary
A lid assembly for a processing chamber in a substrate processing system includes a dielectric window. The dielectric window includes an upper portion having flat upper and lower surfaces. The lower surface is a plasma-facing surface of the dielectric window. A lower portion of the dielectric window is cylindrical and extends downward from the lower surface and an outer diameter of the lower portion at least one of is aligned with a gap between inner and outer coils arranged above the dielectric window and overlaps one of the inner and outer coils.


