Dielectric Window Heating Layout for Uniform Plasma Etching Temperature
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Solution Overview
Problem
Current dielectric window heating devices in plasma etching apparatuses suffer from poor heat dissipation performance due to thermal insulation layers, leading to non-uniform temperature distribution and affecting etching particle performance.
Innovation Solution
A dielectric window heating device with a thermal conductor enclosing a heating element, allowing direct heat transfer to the window while dissipating excess heat through an upper layer and assisted by fans, ensuring uniform temperature distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermal insulation layer is wrapped around the thermal conductive structure, then electrical insulation is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The thermal conductive structure is divided into multiple independent heat dissipation channels: conduction through the support plate, convection through exposed surfaces, and radiation from the dielectric window. This segmentation allows each channel to function independently, improving overall heat dissipation while maintaining electrical insulation through the thermal conductive material itself.
Solution Approach 2:
The thermal conductive structure serves as an intermediary that simultaneously provides thermal conduction, electrical insulation, and mechanical support. By selecting materials with appropriate thermal and electrical properties, the structure acts as a mediator that transfers heat effectively while preventing electrical short circuits, eliminating the need for additional insulation layers.
2Reliability
If the thermal conductive structure is wrapped in thermal insulation material, then safety is improved, but temperature uniformity deteriorates
Solution Approach 1:
The dielectric window is divided into different thermal zones with varying heat flux requirements. The heating element distributes heat non-uniformly across the window surface, with higher heat flux at the center and lower at the edges, compensating for the natural heat loss gradient and achieving uniform temperature distribution across the entire window.
Solution Approach 2:
The heating system dynamically adjusts the heat distribution pattern to maintain temperature uniformity. By controlling the heating element to provide spatially varying heat flux that compensates for thermal losses, the system adapts to changing conditions and maintains optimal temperature uniformity during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform temperature distribution across the dielectric window, reducing etching deposition and improving etching performance.
Implementation Method 1
the heating element is enclosed in the thermal conductor, and is electrically insulated from and in thermal conduction with the thermal conductor
Implementation Method 2
some of the heat of the heating element is dissipated through an upper layer of the thermal conductor located on a side away from the dielectric window
Implementation Method 3
some of the heat of the heating element is dissipated through an upper layer of the thermal conductor located on a side away from the dielectric window
Data Source
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AI summary
A plasma etching apparatus, a dielectric window heating device and a system. In the present invention, a heating element is wrapped by a heat conductor; on one hand, the heat of the heating element can be directly transferred to a dielectric window via a lower heat conductor in direct contact with the dielectric window; and on the other hand, part of the heat of the heating element is dissipated via an upper heat conductor located on a side facing away from the dielectric window. Thus, the heat of the heating element can be rapidly dissipated via the heat conductor, thus avoiding the accumulation phenomenon.