Dielectric Window Plenum Cooling for Uniform TCP Temperature
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Solution Overview
Problem
Existing cooling systems for transformer coupled plasma (TCP) windows in semiconductor manufacturing processes are inadequate, leading to overheating and thermal stress, which limits processing power and can cause cracking.
Innovation Solution
A plenum system with multiple cooling zones and distinct coolant flow patterns is introduced to efficiently cool TCP windows, using different types of coolants and flow rates to minimize temperature gradients and prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single cooling system is used for the dielectric window, then the structure is simple, but the temperature distribution is uneven causing thermal stress and cracking
Solution Approach 1:
The cooling system is divided into multiple independent cooling zones (first cooling zone, second cooling zone, third cooling zone) that can be controlled separately. Each zone has its own coolant flow control, allowing independent temperature management of different regions of the dielectric window to achieve uniform temperature distribution and prevent thermal stress.
Solution Approach 2:
Different cooling strategies are applied to different regions of the dielectric window based on their specific thermal requirements. The first cooling zone cools the first region, the second cooling zone cools the second region, and the third cooling zone provides backup cooling. This localized cooling approach ensures each area receives appropriate cooling to maintain overall temperature uniformity.
2Productivity
If high processing power is used in TCP windows, then productivity increases, but overheating occurs causing thermal stress and cracking
Solution Approach 1:
The cooling system is activated before thermal damage occurs. The first cooling zone and second cooling zone work proactively to maintain temperature within safe operating limits, preventing thermal stress accumulation. The third cooling zone serves as a backup to ensure continuous protection against overheating.
Solution Approach 2:
The cooling system monitors and responds to temperature conditions in real-time, adjusting coolant flow to maintain optimal temperature distribution. This feedback mechanism allows the system to handle high processing power loads while preventing overheating and thermal stress.
3Temperature
If coolant flow rate is increased to cool the dielectric window, then temperature control improves, but temperature gradients increase causing thermal stress
Solution Approach 1:
The cooling system divides the total coolant flow into multiple zones with independent flow control. Each cooling zone can be optimized to provide cooling without creating excessive local temperature gradients. The segmented approach distributes thermal management across multiple regions, reducing overall thermal stress.
Solution Approach 2:
Coolant flow rates are optimized for each specific cooling zone based on the thermal load and thermal sensitivity of that region. This localized optimization ensures effective temperature control while minimizing temperature gradients and thermal stress in each area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The plenum system allows for increased processing power and improved temperature control, preventing TCP window cracking and expanding etch tool capability to operate at higher power levels.
Implementation Method 1
receive a first coolant from the first inlet port, and direct the first coolant across the first area to cool a first portion of the dielectric window
Implementation Method 2
cool a first portion of the dielectric window
Data Source
AI summary
A plenum for a dielectric window of a substrate processing system includes a first inlet port, a backup passage, and a body. The body includes: a first recessed area on a first side of the body and configured to hold a first coil; a first channel; and a second channel. The first channel is on a second side of the body and opposes the first recessed area and receive a first coolant from the backup passage. The backup passage is configured to direct the first coolant across the first channel to cool a first portion of the dielectric window. The second channel is on the second side of the body radially outward of the first channel and receives a second coolant from the first inlet port. The first inlet port is configured to direct the second coolant across the second channel to cool a second portion of the dielectric window.