Layered Dielectric Wiring Board for Low-Loss Curved RF Lines

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Solution Overview

Problem

Current dielectric line technologies face challenges in efficiently transmitting high-frequency waves due to high transmission loss, especially in curved lines, and existing solutions do not adequately address the need for a balance between high permittivity and low loss tangent for effective electromagnetic wave propagation.

Innovation Solution

A wiring board design featuring a dielectric line with a resin (A) and a dielectric exterior (B) where the exterior has a relative permittivity lower than the line, optimized with a specific permittivity ratio of 0.60 to 0.90, and incorporating polytetrafluoroethylene (PTFE) and inorganic powders to minimize transmission loss and enhance wave propagation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If dielectric lines with high relative permittivity are used to reduce transmission loss, then transmission efficiency improves, but loss tangent increases causing higher energy loss

Engineering Contradiction:
Improvetransmission lossVSAvoidloss tangent
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The patent applies local quality by creating a layered dielectric structure where the dielectric line and dielectric exterior have different relative permittivity characteristics. The dielectric line portion has optimized permittivity for low transmission loss, while the dielectric exterior has lower permittivity to control loss tangent, allowing each region to perform its specific function optimally

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs composite materials by combining dielectric line material and dielectric exterior material with different electromagnetic properties. This composite structure enables simultaneous achievement of low transmission loss through the line portion and controlled loss tangent through the exterior portion, resolving the contradiction between these two parameters

Inventive Principle:
Principle #40Composite materials

2Adaptability or versatility

If curved dielectric lines are used for routing, then flexibility and routing capability improve, but transmission loss increases significantly

Engineering Contradiction:
Improverouting flexibilityVSAvoidtransmission loss in curved lines
Core Design Contradiction:
Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The patent applies local quality by providing different dielectric configurations for different portions of the transmission line. In curved sections, the dielectric exterior with lower relative permittivity reduces the discontinuity effect, thereby reducing transmission loss while maintaining routing flexibility. The dielectric line portion maintains its high permittivity characteristics for low loss transmission

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The dielectric exterior acts as an intermediary between the high-permittivity dielectric line and the surrounding environment. In curved portions, this intermediary layer with lower permittivity reduces the abrupt impedance changes that cause transmission loss, thereby enabling flexible routing with reduced energy loss

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables efficient transmission of high-frequency waves with reduced loss, particularly in curved configurations, by balancing the permittivity and loss tangent of the dielectric line and exterior, achieving transmission losses of -3.0 dB or less in curved lines with a radius of curvature of 30 mm.

Implementation Method 1

the dielectric exterior having a relative permittivity lower than a relative permittivity of the dielectric line at 6 GHz and 25° C.

Methodology Applied
Scientific EffectDielectric permittivity: Dielectric Permittivity

Data Source

PatentUS12087988B2Wiring board
Publication Date: 2024.09.10 DAIKIN INDUSTRIES LTD
  • US12087988B2 patent drawing
  • US12087988B2 patent drawing
  • US12087988B2 patent drawing

AI summary

A wiring board including a dielectric line containing a resin (A), and a dielectric exterior covering the dielectric line and containing a resin (B). The dielectric exterior has a relative permittivity lower than a relative permittivity of the dielectric line at 6 GHz and 25° C.