Dielets on Flexible Packaging via Direct Bonding
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Solution Overview
Problem
Achieving high-density communication between small dielets on flexible substrates is challenging, limiting the integration of significant computer memory and microprocessing elements in thin, flexible microelectronics packages.
Innovation Solution
Implementing high-density interconnects through direct-bonding or hybrid bonding techniques between standard interfaces or native interconnects of dielets, enabling fine-pitched conductive lines for efficient communication on flexible, stretchable substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If high-density interconnects are implemented between dielets on flexible substrates, then communication capacity between dielets is improved, but manufacturing complexity increases
Solution Approach 1:
The system segments the microprocessor into multiple dielets that can be independently manufactured and then assembled on flexible substrates. This segmentation allows high-density interconnects to be implemented between smaller dielet units rather than requiring a single large chip, improving communication capacity while managing manufacturing complexity through modular assembly processes
Solution Approach 2:
The patent transitions from conventional two-dimensional planar interconnects to three-dimensional vertical stacking and flexible substrate configurations. By utilizing the third dimension and flexible form factors, high-density interconnects can achieve greater communication capacity without proportionally increasing manufacturing complexity, as the flexible substrates enable new assembly approaches
2Strength
If dielets are made smaller to increase density, then flexibility and shock-resistance are improved, but interconnection density becomes more difficult to achieve
Solution Approach 1:
By segmenting the processor into small dielets, the system achieves both improved shock-resistance through flexibility and manageable interconnection density. Each small dielet can be precisely manufactured with standard interconnect patterns, and the flexible substrate provides a compliant platform for high-density assembly without requiring ultra-fine precision in each individual component
Solution Approach 2:
The patent changes the physical parameters of the interconnect system by using flexible substrates that allow for varying interconnect geometries and densities. This enables optimization of interconnection density without being constrained by rigid substrate limitations, accommodating smaller dielet sizes while maintaining manufacturable interconnect patterns
Data Source
AI summary
Dielets on flexible and stretchable packaging for microelectronics are provided. Configurations of flexible, stretchable, and twistable microelectronic packages are achieved by rendering chip layouts, including processors and memories, in distributed collections of dielets implemented on flexible and/or stretchable media. High-density communication between the dielets is achieved with various direct-bonding or hybrid bonding techniques that achieve high conductor count and very fine pitch on flexible substrates. An example process uses high-density interconnects direct-bonded or hybrid bonded between standard interfaces of dielets to create a flexible microelectronics package. In another example, a process uses high-density interconnections direct-bonded between native interconnects of the dielets to create the flexible microelectronics packages, without the standard interfaces.