Diepoxy Composition for Low-Water-Absorption Optical Curing
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Solution Overview
Problem
Existing diepoxy compounds used in optoelectronic and optical applications suffer from high water absorption rates, leading to deformation and property deterioration under high temperature and humidity conditions due to the presence of ester and ether bonds.
Innovation Solution
Development of diepoxy compounds with specific alkyl and epoxy group configurations, such as compounds A and B, which are synthesized to minimize water absorption by avoiding ester and ether bonds, resulting in a low water absorption rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If diepoxy compounds with ester bonds and ether bonds are used, then adhesive properties and mechanical properties are improved, but water absorption rate increases causing deformation under high temperature and humidity
Solution Approach 1:
The patent removes the harmful ester and ether bonds from the diepoxy compound structure. Specifically, it uses diepoxy compounds where the cyclohexane rings are connected directly through carbon-carbon bonds (e.g., 2,2-bis[4-(2,3-epoxypropoxy)cyclohexyl]propane) rather than through ester or ether linkages, thereby eliminating the source of hydrolysis and water absorption while preserving mechanical properties
Solution Approach 2:
The patent changes the chemical structure parameters of the diepoxy compound by selecting specific molecular architectures with direct carbon-carbon connections between cyclohexane rings. This structural parameter change fundamentally alters the water absorption behavior from high (due to ester/ether bonds) to low (due to hydrocarbon-like stability), while maintaining other performance characteristics
2Object-affected harmful factors
If diepoxy compounds without ester or ether bonds are used, then water absorption rate is reduced, but it becomes difficult to sufficiently reduce water absorption rate
Solution Approach 1:
The patent employs composite structural features within the diepoxy compound molecule itself, combining cyclohexane ring systems with specific alkyl bridge groups (methyl, ethyl, propyl, or isopropyl groups). This composite molecular design creates a structure that inherently resists water absorption while maintaining thermal and humidity stability, achieving both low water absorption rate and high reliability
3Ease of manufacture
If conventional diepoxy compounds are used, then ease of manufacture is maintained, but cured products are prone to hydrolysis under high temperature and high humidity conditions
Solution Approach 1:
The patent takes the inherent stability of carbon-carbon bonded cyclohexane structures and converts this characteristic from a neutral feature into a beneficial property for hydrolysis resistance. By designing the molecule so that the cyclohexane rings are connected through robust C-C bonds rather than hydrolyzable bonds, the structure naturally resists degradation under high temperature and humidity conditions while remaining straightforward to synthesize
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The synthesized diepoxy compounds produce cured products with a water absorption rate of 0.45% or less, maintaining durability and preventing deformation even under high temperature and humidity, suitable for optical and electronic components.
Implementation Method 1
Cured products obtained by polymerizing the epoxy compounds
Data Source
AI summary
A diepoxy compound represented by the following formula 1,where any one of R1 groups is an epoxy group, and the remaining R1 groups each independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 10 carbon atoms, and any one of R2 groups is an epoxy group, and the remaining R2 groups each independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 10 carbon atoms.