Differential Signal Circuit Board Impedance Matching via Dielectric Contrast
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Solution Overview
Problem
In circuit boards, the limited area of the base layer restricts the size of electrically conductive components, leading to mismatched equivalent impedance with conductive lines, causing signal reflection and distortion, especially at high frequencies.
Innovation Solution
Incorporating an insulating component with a different dielectric constant into the base layer, positioned close to or in contact with electrically conductive components, allows for adjustment of equivalent impedance to match the conductive lines, reducing signal reflection and distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the size of electrically conductive components is restricted due to limited base layer area, then the circuit board can maintain compact size, but the equivalent impedance of the electrically conductive components cannot match the equivalent impedance of the electrically conductive lines, causing signal reflection and distortion
Solution Approach 1:
The patent introduces an insulating component with a dielectric constant different from the base layer, positioned adjacent to the electrically conductive component. This creates a local modification of the electromagnetic field environment, allowing the equivalent impedance of the electrically conductive component to be adjusted to match the conductive lines without changing the overall base layer area. The local quality change enables impedance matching in a compact space.
Solution Approach 2:
The patent changes the dielectric constant parameter by introducing an insulating component with a different dielectric constant than the base layer. This parameter change allows adjustment of the equivalent impedance of the electrically conductive component. By selecting appropriate dielectric constant values for the insulating component, the impedance can be optimized to match the conductive lines, reducing signal reflection and distortion.
2Device complexity
If the equivalent impedance of electrically conductive components does not match the equivalent impedance of electrically conductive lines, then the circuit board structure is simple, but signal reflection occurs while the differential signal passes through, resulting in signal distortion
Solution Approach 1:
The insulating component acts as an intermediary element between the electrically conductive component and the surrounding base layer. It mediates the electromagnetic field distribution to achieve impedance matching, reducing signal reflection and distortion. This intermediary approach allows impedance optimization without significantly complicating the overall circuit board structure.
3Speed
If high-frequency differential signals are transmitted, then the signal transmission capacity is improved, but the signal distortion becomes more severe due to impedance mismatch
Solution Approach 1:
The patent modifies the dielectric parameter by introducing an insulating component with a different dielectric constant, which adjusts the equivalent impedance of the electrically conductive component. This parameter change is particularly effective for high-frequency signals, as it reduces impedance mismatch and minimizes signal reflection and distortion, thereby maintaining signal integrity at high transmission frequencies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective transmission of high-frequency differential signals by matching the impedance of electrically conductive components with the conductive lines, minimizing signal distortion.
Implementation Method 1
The base layer has a first equivalent dielectric constant. The insulating component has a second equivalent dielectric constant. The first equivalent dielectric constant is different from the second equivalent dielectric constant.
Data Source
AI summary
A differential signal transmitting circuit board includes a substrate, at least two differential conductive elements, and at least one insulating element. The differential conductive elements are disposed in the substrate. The insulating element is disposed in the substrate. The insulating element is close to or contacted to the differential conductive elements. A material of the substrate has a first equivalent dielectric constant. A material of the insulating element has a second equivalent dielectric constant. The first equivalent dielectric constant is different from the second equivalent dielectric constant.