Differential HPA-Radiator Array Impedance Matching

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Solution Overview

Problem

Conventional integrated antenna systems face inefficiencies due to impedance mismatch between the radiator and free space, leading to low power efficiency, high thermal loads, increased weight, and reduced bandwidth, particularly in active electronically scanned arrays where compactness is crucial.

Innovation Solution

An integrated differential high power amplifier-radiator array is designed with an impedance matching balun and a high impedance slotline isolator, using a differential Class-B push-pull cascode amplifier with a high output impedance to drive a reduced height wide band radiator, matching the impedance to free space without a long flare taper.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a conventional integrated antenna system uses separate components (radiator, balun, filter, circulator, HPA) designed to common 50 ohm interface impedance, then the system can be manufactured with standardized components, but the impedance mismatch between radiator and free space causes low power efficiency and high thermal loads

Engineering Contradiction:
Improvestandardized component manufacturingVSAvoidpower efficiency
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent merges the HPA and radiator into an integrated differential HPA-radiator array where the HPA outputs directly drive the radiating elements. This integration eliminates the need for separate impedance matching components and allows the system to operate with high output impedance throughout, resolving the contradiction between standardized manufacturing and power efficiency by creating a unified structure that maintains impedance consistency.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the impedance parameter from the conventional 50 ohm system to a high output impedance system (100-200 ohms differential). By redesigning the HPA and radiator to operate at this new impedance level, the system achieves better power efficiency while maintaining manufacturability through consistent design parameters across all components.

Inventive Principle:
Principle #35Parameter changes

2Ease of operation

If a conventional system uses impedance matching components to connect HPA and radiator, then the system can operate at standard impedances, but the system volume and weight increase

Engineering Contradiction:
Improvestandard impedance operationVSAvoidsystem weight
Core Design Contradiction:
Ease of operationVSWeight of stationary object

Solution Approach 1:

The patent combines the HPA and radiator into a single integrated structure that eliminates the need for separate impedance matching components like traditional baluns and circulators. This merging reduces the overall system weight while maintaining operational effectiveness through direct coupling of the high-impedance components.

Inventive Principle:
Principle #5Merging (Combining)

3Loss of energy

If a conventional antenna uses a longer radiator impedance taper to reduce impedance mismatch, then the power efficiency improves, but the antenna bandwidth reduces and physical size increases

Engineering Contradiction:
Improvepower efficiencyVSAvoidantenna bandwidth
Core Design Contradiction:
Loss of energyVSAdaptability or versatility

Solution Approach 1:

The patent changes the fundamental impedance parameter from 50 ohm to high output impedance (100-200 ohms differential) throughout the HPA and radiator structure. This parameter change eliminates the need for long impedance tapers, allowing the antenna to achieve high power efficiency while maintaining compact size and wide bandwidth through direct high-impedance coupling.

Inventive Principle:
Principle #35Parameter changes

4Ease of manufacture

If an active electronically scanned array uses conventional impedance matching, then the system can be designed with standard components, but the thermal loads increase and prime power requirements increase

Engineering Contradiction:
Improvestandard component designVSAvoidthermal loads
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent integrates the HPA and radiator into a unified high-impedance structure that eliminates energy losses from impedance mismatch. This integration reduces the thermal loads generated by resistive heating in mismatch components, thereby reducing prime power requirements while maintaining design simplicity through consistent impedance architecture.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentEP2856204B1Differential high power amplifier for a low profile, wide band transmit array
Publication Date: 2016.08.10 RAYTHEON CO
  • EP2856204B1 patent drawingFigure 1
  • EP2856204B1 patent drawingFigure 2
  • EP2856204B1 patent drawingFigure 3

AI summary

An integrated differential high power amplifier-radiator array that overcomes the prior art impedance match issues is described. An impedance matching balun is used to feed a high output impedance, differential HPA, which in turn drives a wide band radiator or array of radiators having a matching input impedance to provide a highly efficient, compact transmit system. In one exemplary embodiment, the HPA may be a high impedance Class-B HPA configured as a push-pull cascode amplifier. A high impedance isolator or circulator may be used between the HPA and the radiator. One of ordinary skill in the art will readily appreciate that a receive implementation, using a properly matched low noise amplifier in place of the HPA, is also possible. Similarly, with the addition of a slotline circulator, transceiver operation is also attainable with the addition of an impedance matched receive chain.