Differential Model for IC Process Parameter Matching

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Solution Overview

Problem

Current semiconductor manufacturing processes face challenges in maintaining consistent behavior when transitioning between different equipment, resists, or processes, requiring time-consuming and costly tuning of physical parameters to achieve identical results, which is burdensome and computation-heavy due to the need for multiple calibration steps and complex model inversions.

Innovation Solution

A single differential model is implemented to mimic one process from another, reducing calibration and correction efforts, allowing for flexible process matching with constraints such as interpolation, extrapolation, and linearity imposition, and enabling the use of a single calibration layout or metrology results without requiring functional models.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple calibration steps and complex model inversions are performed to maintain consistent process behavior when transitioning between different equipment or processes, then manufacturing precision is improved, but computational workload and time consumption increase significantly

Engineering Contradiction:
Improveprocess consistencyVSAvoidcalibration time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent merges multiple calibration steps and model inversions into a single unified calibration procedure. By combining the calibration of different process models into one simultaneous operation, the system achieves consistent process behavior across different equipment while reducing the total calibration time and computational burden.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent creates a universal calibration framework that can handle multiple process models and equipment types simultaneously. The single calibration procedure is designed to work across different lithography tools and process conditions, making the calibration process multi-functional and adaptable to various manufacturing scenarios without requiring separate calibration steps for each case.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Manufacturing precision

If physical process parameters are tuned to maintain identical behavior from previous flows, then manufacturing precision is improved, but the process becomes more complex and costly

Engineering Contradiction:
Improveprocess behavior consistencyVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent automatically adjusts physical process parameters through a single calibration procedure that computes optimal parameter sets for different equipment and process conditions. This eliminates the need for manual parameter tuning and reduces process complexity by providing automated parameter optimization that maintains consistent manufacturing behavior across varying conditions.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If two distinct models are calibrated and multiple calculation procedures are run to transfer process targets, then manufacturing precision is improved, but computational workload increases

Engineering Contradiction:
Improvemodel accuracyVSAvoidcomputational energy
Core Design Contradiction:
Manufacturing precisionVSUse of energy by moving object

Solution Approach 1:

The patent combines multiple calculation procedures into a single integrated computational framework. By merging the calibration of two distinct models and the transfer of process targets into one unified calculation procedure, the system maintains high model accuracy while significantly reducing computational energy consumption and processing time.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentEP3152623B1Method for determining the parameters of an IC manufacturing process by a differential procedure
Publication Date: 2021.11.17 ASELTA NANOGRAPHICS
  • EP3152623B1 patent drawingFigure 1
  • EP3152623B1 patent drawingFigure 2
  • EP3152623B1 patent drawingFigure 3

AI summary

The invention discloses a method to easily determine the parameters of a second process for manufacturing from the parameters of a first process. Metrics representative of the differences between the two processes are computed from a number of values of the parameters, which can be measured for the two processes on a calibration layout, or which can be determined from pre-existing values for layouts or reference data for the two processes by an interpolation/extrapolation procedure. The number of metrics is selected so that their combination gives a precise representation of the differences between the two processes in all areas of a design. Advantageously, the metrics are calculated as a product of convolution of the target design and a compound of a kernel function and a deformation function.