Differential Pair Connector Layout Without a Backplane

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional switch architectures using backplanes for signal interconnection between service line cards and network switch cards result in poor ventilation and heat dissipation, and hinder high-speed data transmission due to long signal links.

Innovation Solution

A differential pair module and connector design that directly connects service line cards and network switch cards without a backplane, utilizing bent signal conductive connection parts and broadside/edge coupling configurations to facilitate high-speed data transmission and improve thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a backplane is used for signal interconnection between service line cards and network switch cards, then signal transmission is implemented, but ventilation and heat dissipation performance deteriorates and signal link length increases

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidbackplane structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent extracts and removes the backplane from the system architecture. Service line cards and network switch cards are directly connected through connectors on opposite sides of the chassis, eliminating the intermediate backplane structure. This extraction resolves the contradiction by removing the source of heat accumulation and structural complexity while maintaining signal transmission capability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent transitions from a planar signal transmission path (through the backplane) to a three-dimensional direct connection approach. Connectors are positioned on opposite sides of the chassis, allowing signals to transmit directly through the chassis volume without traversing the backplane surface, thereby shortening the signal link and improving thermal management.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Speed

If a backplane is used for signal interconnection, then signal transmission is implemented, but signal link length increases hindering high-speed data transmission

Engineering Contradiction:
Improvedata transmission speedVSAvoidsignal link length
Core Design Contradiction:
SpeedVSLength of stationary object

Solution Approach 1:

By removing the backplane from the signal path, the patent eliminates the lengthy transmission route that traverses the backplane. Direct connectors on opposite chassis sides create a short signal path, enabling high-speed data transmission up to 56 Gbps to 112 Gbps as stated in the patent.

Inventive Principle:
Principle #2Taking out (Extraction)

3Length of stationary object

If signal terminals are directly connected between PCB boards, then signal link length is shortened, but manufacturing precision requirements increase due to bent conductive connection parts

Engineering Contradiction:
Improvesignal link lengthVSAvoidassembly precision
Core Design Contradiction:
Length of stationary objectVSManufacturing precision

Solution Approach 1:

The patent employs bent conductive connection parts with specific geometric configurations. The signal conductive connection parts include bends at defined angles (e.g., 45 degrees or 90 degrees) to navigate between PCB boards while maintaining electrical connectivity. These standardized curved geometries balance the need for short signal paths with manufacturability and assembly precision.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent specifies precise geometric parameters for the bent conductive connection parts, including bend angles, radii, and positions. By controlling these parameters, the design achieves optimal signal transmission while maintaining manufacturing feasibility and assembly precision within tolerances.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances ventilation and heat dissipation, shortens signal links, and enables high-speed data transmission up to 56 Gbps to 112 Gbps, while simplifying manufacturing processes and improving assembly precision.

Implementation Method 1

the second signal conductive connection part and the first signal conductive connection part are stacked with a specific spacing and form an edge coupling

Methodology Applied
Scientific EffectEdge coupling:

Implementation Method 2

the second signal body part and the first signal body part are stacked with a specific spacing and form a broadside coupling

Methodology Applied
Scientific EffectBroadside coupling:

Data Source

PatentUS12334689B2Differential pair module, connector, communications device, and shielding assembly
Publication Date: 2025.06.17 HUAWEI TECH CO LTD
  • US12334689B2 patent drawing
  • US12334689B2 patent drawing
  • US12334689B2 patent drawing

AI summary

This application provides a differential pair module, including a first signal terminal and a second signal terminal. The first signal terminal includes a first signal tail part, a first signal body part, and a first signal conductive connection part that are successively connected. An extension plane of the first signal conductive connection part and an extension plane of the first signal body part form an included angle, and an extension direction of the first signal conductive connection part and an extension direction of the first signal tail part form an included angle. The second signal terminal includes a second signal tail part, a second signal body part, and a second signal conductive connection part that are successively connected. Solutions in this application can implement a PCB board connection architecture having no backplane.