Differential Pin Layout for Compact Chip Packaging and Low Crosstalk
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The use of differential signal transmission in microelectronic products necessitates a large number of ground pins around each differential pin pair to prevent crosstalk, leading to increased package size and hindering miniaturization.
Innovation Solution
A chip packaging apparatus design where additional pins, either differential signal or power pins, are positioned between and symmetrically arranged relative to differential signal pins, forming a zero potential plane to reduce resonant circuit formation and crosstalk, allowing for a more compact layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground pins are disposed around each differential pin pair to isolate adjacent differential pin pairs and reduce crosstalk, then signal integrity is improved, but package size increases
Solution Approach 1:
The patent combines multiple functions into the pins positioned between differential pin pairs: they serve as ground references for isolation while simultaneously functioning as signal or power pins. This merging eliminates the need for dedicated ground pins while maintaining crosstalk isolation, thereby reducing package size while preserving signal integrity
Solution Approach 2:
The pins located between adjacent differential pin pairs are designed to perform multiple functions: they provide ground reference for isolating adjacent differential signals to prevent crosstalk, while also serving as additional signal transmission pins or power supply pins. This multi-functionality increases pin utilization efficiency and reduces the overall package size
2Object-affected harmful factors
If a large quantity of ground pins are disposed between chip and external component to accommodate isolation requirements, then crosstalk reduction is improved, but the package size needs to be increased
Solution Approach 1:
The patent extracts the ground isolation function from dedicated ground pins and integrates it into the pins positioned between differential pin pairs. By taking out the ground reference requirement and combining it with signal/power pin functions, the design reduces the total number of pins needed while maintaining effective crosstalk isolation
Solution Approach 2:
The patent changes the functional parameters of the pins between differential pin pairs from single-function (either ground or signal) to multi-functional (ground reference plus signal or power). This parameter change allows the same physical pins to fulfill multiple roles, reducing package size while maintaining crosstalk protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design increases the number of signal and power pins within a limited space while minimizing resonant circuit formation and crosstalk, enhancing signal integrity and reducing package size.
Implementation Method 1
a zero potential plane that overlaps a plane of symmetry of the first differential signal pin and the second differential signal pin is formed under excitation of a differential signal transmitted on the first differential signal pin and the second differential signal pin
Data Source
AI summary
A chip packaging apparatus includes a first differential pin pair, a first pin, and a second pin. The first differential pin pair includes a first differential signal pin and a second differential signal pin. In addition, the first pin and the second pin are both located between the first differential signal pin and the second differential signal pin, and the first pin and the second pin are differential signal pins (or both are power pins). The first pin is adjacent to the first differential signal pin and the second differential signal pin. The second pin is adjacent to the first differential signal pin and the second differential signal pin. The first pin and the second pin are respectively located on two sides of a first imaginary straight line connecting the first differential signal pin to the second differential signal pin.