Differential Pressure Sensor Package Structure for Electronic Devices
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Solution Overview
Problem
Current electronic devices that detect gas pressure differences require two gas pressure sensors, leading to increased cost, larger size, and reduced reliability due to dependency on both sensors for accurate detection.
Innovation Solution
A package structure for a differential pressure sensor featuring a single pressure sensing element with a pressure sensing layer between two chambers, connected via through holes, and an ASIC chip for calculating differential pressure values, reducing the need for multiple sensors and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two gas pressure sensors are configured on a PCB board to detect differential pressure, then the detection function is achieved, but the cost increases and the device occupies larger space
Solution Approach 1:
The patent combines two separate gas pressure sensors into a single integrated differential pressure sensor. The sensor includes a sensing element with a diaphragm that directly measures the pressure difference between two chambers, eliminating the need for two independent sensors and their associated processing circuits. This merging reduces device complexity while maintaining detection reliability.
Solution Approach 2:
The single differential pressure sensor performs the function of what would traditionally require two separate pressure sensors. The sensing element is designed to simultaneously respond to pressure differences, providing differential pressure detection capability in one integrated component rather than requiring multiple universal pressure sensing elements.
2Reliability
If two gas pressure sensors are used for differential pressure detection, then the detection coverage is sufficient, but the product size increases and small-size design becomes difficult
Solution Approach 1:
The patent integrates the functionality of two pressure sensors into a single compact differential pressure sensor module. The sensing element with its diaphragm and two pressure chambers is housed in one small package, dramatically reducing the volume required compared to two separate sensors mounted on a PCB board.
3Measurement precision
If two gas pressure sensors are configured to detect differential pressure, then the detection capability is achieved, but the system reliability decreases due to strong dependency between sensors
Solution Approach 1:
The patent uses a single integrated sensing element with a diaphragm that directly measures the pressure difference between two chambers. This eliminates the dependency between two separate sensors, as the measurement is made by one unified element. The differential pressure is measured directly at the diaphragm surface, providing both precision and reliability without the vulnerabilities of multi-sensor systems.
4Device complexity
If a single pressure sensing element with two chambers is used, then the device size is reduced and cost is lowered, but the detection accuracy must be maintained
Solution Approach 1:
The patent applies local quality by creating a dedicated pressure sensing zone at the diaphragm surface where the differential pressure measurement occurs. The diaphragm is specifically designed with appropriate thickness and material properties at the sensing location to ensure high measurement precision. The two pressure chambers are configured to deliver pressure to specific locations on the diaphragm, optimizing the local measurement quality while maintaining overall device simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables accurate and reliable detection of gas pressure differences with a compact design, lower costs, and reduced power consumption, as the single pressure sensing element and ASIC chip configuration improve detection accuracy and extend standby time.
Implementation Method 1
the pressure sensing element comprises a second chamber and a pressure sensing layer, and the pressure sensing layer is disposed between the first chamber and the second chamber
Data Source
AI summary
A package structure for a differential pressure sensor, and an electronic device are provided. The package structure includes: a substrate and a housing, an edge of the housing is fixed to a front side of the substrate and defines a first chamber with the substrate; and a pressure sensing element fixed to the front side of the substrate and disposed in the first chamber, the pressure sensing element is provided with a second chamber and a pressure sensing layer, the pressure sensing layer being disposed between the first chamber and the second chamber. The first chamber is connected with the outside via a first through hole, and the second chamber is connected with the outside via a second through hole.